Advances in Intelligent Processing, Data Mining and Microsystems
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Artificial Intelligence".
Deadline for manuscript submissions: 15 April 2026 | Viewed by 80
Special Issue Editors
Interests: data mining; remote sensing; object detection; microsystem
Interests: data mining; multi-modal learning; manifold learning
Special Issue Information
Dear Colleagues,
This Special Issue of *Electronics* (ISSN 2079-9292), entitled “Advances in Intelligent Processing, Data Mining and Microsystems”, aims to showcase cutting-edge research on the integration of intelligent technologies, data-driven, and microsystem innovations, addressing key challenges in their synergy for next-generation electronic systems. It will serve as a platform for pioneering research articles and reviews, highlighting novel methodologies in intelligent algorithm design, efficient data mining techniques, and breakthroughs in microsystem development, with a focus on bridging theoretical advancements and practical applications to drive technological progress in electronics.
Intelligent processing and data mining are fundamental enablers of smart systems, enabling real-time analysis, pattern recognition, and informed decision-making across various fields, including IoT, healthcare, and industrial automation. This Issue will explore advanced algorithms (e.g., deep learning optimization, federated learning), data preprocessing and feature engineering, as well as domain-specific applications (e.g., predictive maintenance, smart sensing data analytics).
Microsystems and chiplet integration, as two critical directions in semiconductors, are central to this Special Issue. Microsystems focus on compact, multifunctional system design, while chiplet integration promotes modular chip innovation. Their research covers 3D stacked packaging architectures for enhanced space efficiency, standardized interface protocols for inter-module compatibility, multi-physics co-simulation modeling to address thermal/electrical coupling, and high-coverage testing methods for reliability.
We invite contributions from academia, industry, and policy-making circles to foster interdisciplinary dialogue and collaboration. By integrating these three fields, this Issue aims to advance electronic system performance, miniaturization, and intelligence, thereby supporting global technological innovation and sustainable development goals.
Dr. Yuanjie Zhi
Dr. Tao Yang
Dr. Xiaoyu Hu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- intelligent processing
- data mining
- deep learning optimization
- pattern recognition
- smart algorithm
- microsystems, chiplet integration
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