Radiation Tolerant Digital and Analog Circuits and Systems

Dear Colleagues,

Global demand for radiation-tolerant digital and analog circuits has increased dramatically in recent years. This demand is mainly driven by the vast growth in space applications ranging from satellite communication, surveillance, and instrumentations with the rise of New Space and Space 2.0. New custom radiation-tolerant electronics are needed, and more validation and qualification strategies are required for off-the-shelf components. In addition, there is increased demand for high-reliability electronics in the automobile industry, data servers and switches, high-energy physics experiments and many terrestrial nuclear applications. The electronics in these applications must be radiation-hardened to enable them to function effectively in those environments. As a result, the research on radiation-tolerant electronics has increased rapidly, resulting in many interesting approaches to modelling radiation effects and developing radiation-hardened digital and analog integrated circuits. The advanced CMOS integrated circuit technologies (FDSOI and FinFET processes) have improved single event upset performance, however, the total dose effects need to be further explored to meet the demands of various radiation environments. In addition, the growing complexity of microelectronics, such as highly integrated SOC and FPGAs, imposes significant challenges in radiation hardness assurance with multiple components, mixed signals and mixed technologies at the system level. New testing paradigms and verification methods are required to reduce the cost in verification. Pulsed lasers have shown their effectiveness in evaluating sensitive areas, however, the correlation between the laser and heavy ion cross-sections still remains a challenge for two-photon lasers.

The main aim of this Special Issue is to seek high-quality submissions that highlight emerging applications of radiation-tolerant systems, address recent breakthroughs in modeling radiation effects in advanced electronic devices and circuits, present designs of radiation-hardened digital, analog, mixed-signal, and RF integrated circuits, and radiation hardness testing methodologies. The topics of interest include, but are not limited to:

• Basic mechanisms of radiation effects in electronic devices;
• Compact modeling of radiation effects and circuit/layout level optimization (TID and SEE);
• Radiation effects in power devices/circuits;
• Design of radiation-hardened integrated circuits (analog/RF/mixed-signal/digital);
• Radiation hardening and fault tolerance in FPGAs;
• Radiation hardness assurance testing.

Prof. Dr. Li Chen
Prof. Dr. Haibin Wang
Dr. Kai Xi
Dr. Liang Wang
Dr. Rui Chen
Guest Editors

Manuscript Submission Information

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• radiation effect
• total ionizing dose effect
• single-event effect
• spacecraft charging
• radiation hardening
• digital and analog circuits
• integrated circuit
• radiation environment
• hardness assurance
• pulsed laser