Advances in Fluid Mechanics and Heat Transfer

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Power Electronics".

Deadline for manuscript submissions: 15 March 2026 | Viewed by 10

Special Issue Editors


E-Mail Website
Guest Editor
Faculty of Mechanical Engineering and Ship Technology, Gdańsk University of Technology, 80-233 Gdansk, Poland
Interests: heat transfer; energy conversion; condensation; boiling

E-Mail Website
Guest Editor
Faculty of Mechanical Engineering and Ship Technology, Gdańsk University of Technology, 80-233 Gdansk, Poland
Interests: heat transfer; energy conversion

E-Mail Website
Guest Editor
Faculty of Mechanical Engineering and Ship Technology, Gdańsk University of Technology, 80-233 Gdansk, Poland
Interests: heat transfer; energy conversion
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Faculty of Mechanical Engineering and Ship Technology, Gdańsk University of Technology, 80-233 Gdansk, Poland
Interests: heat transfer; energy conversion; heat pipe

Special Issue Information

Dear Colleagues,

The rapid advancement of electronic technologies has intensified the need for efficient thermal management and fluid flow control. As devices become more compact and powerful, understanding and optimizing heat transfer and fluid dynamics is critical to ensuring performance, reliability, and energy efficiency. The recent boom in AI data center development has required new and more efficient thermal management systems. This research area is increasingly interdisciplinary, bridging mechanical engineering, materials science, and electronics.

This Special Issue aims to present recent developments in fluid mechanics and heat transfer, with a focus on their applications in electronic systems. It aligns with the scope of Electronics by addressing challenges in thermal design, cooling technologies, and energy systems that directly impact electronic device performance and stability.

We invite original research articles, reviews, and case studies on topics including but not limited to:

  • Forced and natural convection in electronic systems;
  • Boiling and condensation heat transfer;
  • Micro- and nanoscale fluid flow and thermal transport;
  • Phase-change materials and thermal interface materials;
  • Heat pipes, vapor chambers, and advanced cooling techniques;
  • AI and machine learning in thermal fluid optimization;
  • Thermal management in power electronics.

This Special Issue provides a platform for researchers and engineers to share innovative solutions and foster collaboration across disciplines.

We look forward to receiving your contributions.

Dr. Stanisław Głuch
Dr. Marta Drosińska-Komor
Dr. Paweł Ziółkowski
Dr. Pawel Szymanski
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • heat transfer
  • thermal fluid optimization
  • thermal management
  • thermal transport

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Published Papers

This special issue is now open for submission.
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