Advances in Microelectronic Materials, Processes and Devices

Dear Colleagues,

Silicon microelectronics is at the heart of modern electronics, finding applications in computing, data processing, data storage, communications or internet-of-things field. Its development has been guided by Moore’s law since the 70’s and is nowadays reaching its physical limits related to device dimension,  integration density and complexity both in CMOS and memory technologies. To overcome these limits, new challenges have been addressed regarding new material integration for FEOL and BEOL purpose, new processes for material growth, deposition, doping, etching and patterning, new device architectures for better scalability, improved physical characterization techniques for CD metrology, advanced device and interconnect electrical characterization methodologies.

We invite researcher to contribute works on the “Advances in Microelectronic Materials, Processes and Devices” topic. Potential subjects include, but are not limited to: 

• New material;
• Integration processes;
• Device architectures;
• Physical characterization and metrology;
• Electrical characterization and reliability;

Prof. Gerard Ghibaudo
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

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