Engineering Proceedings, Volume 55, Issue 1
IEEE ECBIOS 2023 2023 - 97 articles
Tainan, Taiwan | 2–4 June 2023
Volume Editors:
Teen-Hang Meen, National Formosa University, Taiwan
Kuei-Shu Hsu, Chia Nan University of Pharmacy and Science, Taiwan
Cheng-Fu Yang, National University of Kaohsiung, Taiwan; Chaoyang University of Technology, Taiwan
Cover Story: This volume represents the proceedings of the 5th IEEE Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability 2023 (IEEE ECBIOS 2023). This conference was held at the Chia Nan University of Pharmacy and Science, Tainan, Taiwan, on June 2–4, 2023, being co-organized by the Chia Nan University of Pharmacy and Science, the Institute of Electrical and Electronics Engineers (IEEE), and the International Institute of Knowledge Innovation and Invention (IIKII). One hundred and five excellent papers in relevant engineering fields were selected through peer review for the publication of the proceedings of IEEE ECBIOS 2023. The proceedings are expected to help accelerate the interdisciplinary collaboration and international networking of science and engineering technologists in the academic and industrial fields.
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