Studies on Electronic Packaging Materials and Bonding Technology

Dear Colleagues,

Today, the proportion of advanced packaging and bonding technology in semiconductor manufacturing is increasing because of the limitation of development of devices by the shrinkage of dies. Many kinds of technologies, such as 2.5D, 3D, wafer-level packaging, and any other advanced bonding technologies, are employed or researched in companies and laboratories. Nevertheless, demands around these technologies are still increasing. Packaging materials and bonding technologies are especially vital parts of this trend because they have essential roles in back-end processes. The more the process develops, the more advanced packing materials and bonding techniques are needed.

This Special Issue addresses research on all kinds of electronic packaging materials, such as metals, alloys, ceramics, semiconductors, etc. Additionally, we welcome articles and reviews about bonding technologies, including solder bonding, metal to metal bonding, adhesive bonding, 3D integration, surface treatment, investigation of characterization and reliability of the wafer bond, and so on.

Prof. Dr. Bongyoung Yoo
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.