Advanced Microstructural Characterization and Data-Driven Modeling of Engineering Materials for Manufacturing Processes

Dear Colleagues,

This Special Issue will focus on the microstructure-resolved mechanics, advanced material characterization, and AI-driven predictive modeling of engineering materials used in manufacturing processes. We specifically aim to attract contributions that integrate state-of-the-art experimental techniques, including in situ microscopy, high-resolution EBSD, 4D imaging, and diffraction-based methods (X-ray, synchrotron, and neutron), to uncover the fundamental microstructural mechanisms governing material behavior during heating, solidification, deformation, and additive or subtractive manufacturing.

In parallel, we highlight advances in computational and data-driven approaches, spanning finite element and multiscale simulations, computational fluid dynamics, phase-field and crystal plasticity modeling, and modern machine learning/artificial intelligence frameworks for microstructure prediction, property estimation, and process optimization. These methods collectively enable deeper mechanistic insight and more accurate prediction of material response across scales.

By bridging high-end characterization, physics-based simulations, and AI-enhanced modeling, this Special Issue aims to showcase innovative strategies that accelerate the design, understanding, and optimization of materials in next-generation manufacturing technologies. We welcome contributions that push the boundaries of integrating experimental, computational, and data-driven perspectives.

Dr. Fatih Uzun
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

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