Special Issue "Advanced Materials/Devices for Power Electronics"
Deadline for manuscript submissions: closed (31 October 2019).
Interests: power electronics; power semiconductor device; electrical characterization of power devices and power converters; CAE of power electronic system integration; multi-physics modeling; bond graph
The integration of renewable energies in traditional AC or DC electricity grids (HVDC, MVDC, LVDC) and the need for better energy efficiency have led to the increased electrification of our energy consumption. This requires more and more power converters with high performance (efficiency, compactness, reliability and ability to withstand harsh environments). To achieve these goals, more powerful power devices and materials with sharp features are needed. Power electronics has seen the arrival of new devices that perform better on silicon (trench, super-junctions, etc.) or based on materials with a wide band gap (SiC, GaN, Diamond), new structural variants (MOSFET, JFET, BJT, Schottky diodes, thyristor, HEMT and their combinations) with very sophisticated multiphysics analysis and design needs (close control, EMC disturbances, multiphysics optimizations).
The performance of these new devices also requires high-performance materials (electrical and thermal conductors, insulators, magnetic dielectrics) for the realization of passive components (capacitors and inductors, etc.) or the integration of chips into power integrated circuits or hybrid module performance and reliable power (packaging, encapsulation, ability to withstand harsh environments).
Prospective authors are invited to submit original contributions, survey papers or tutorials for review and potential publication in this Special Issue. Topics of interest include, but are not limited to:
- New power devices (Si, SiC, GaN, Diamond, etc.) for advanced operation.
- Characterization and modeling of new power devices.
- Power devices in their environment (gate drive, packaging, thermal management, etc.).
- New materials (conductor, thermal management, insulator, dielectric, magnetic, etc.) for advanced power electronics.
- Material modeling and characterization for advanced power electronics.
Dr. Hervé Morel
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- power semiconductor devices
- wide band gap
- power device modeling and characterization
- material for advance power electronics
- energy efficiency, compactness and reliability