Interconnects for Electronics Packaging

Dear Colleagues,

Advanced heterogeneous integration as the key enabler of the “more than Moore” era demands disruptive interconnects technologies. These interconnects enable 3D integration, chip embedding, and enhanced thermal and electrical performances, which lead to device shrinkage, an increase in computing efficiency, superior switching speed, and power. The continued scaling of interconnects has faced cost, integration, thermal, and reliability challenges, which require innovations in terms of both technologies and materials. This Special Issue will cover the most advanced and emerging interconnects. A reliability analysis and failure analysis of the emerging interconnects will also be addressed here. We encourage original research works describing novel interconnecting technologies, materials and processes that can potentially lead to significant advances in the field of microelectronics packaging.

Dr. Ali Roshanghias
Prof. Dr. Ha Duong Ngo
Guest Editors

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