Digital Integrated Circuits and Systems
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".
Deadline for manuscript submissions: 15 May 2026 | Viewed by 9
Special Issue Editors
Interests: RF filters; RF circuits; sensing systems; biosensing
Interests: 6G mobile communications; internet of things; multi-scenario channel modeling; intelligent transmission technology
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue focuses on cutting-edge advancements in Integrated Circuits (ICs) and Systems. With the rapid evolution of artificial intelligence, edge computing, and next-generation communication technologies, there is an urgent need for high-performance, energy-efficient, and scalable IC designs. This issue will explore novel methodologies in circuit design, system integration, and emerging applications across domains such as neuromorphic computing, quantum processors, biomedical electronics, and autonomous systems. We seek contributions addressing challenges in nanoscale fabrication, low-power optimization, heterogeneous integration, and hardware security.
Scope includes (but not limited to):
- Advanced IC Design: Analog/RF/mmWave circuits, mixed-signal systems, SoC/NoC architectures
- Emerging Technologies: 3D-ICs, chiplets, memristor-based designs, silicon photonics integration
- AI & Compute Systems: AI accelerators, in-memory computing, neuromorphic hardware
- Low-Power & Resilient Design: Energy harvesting ICs, near-threshold computing, fault-tolerant systems
- Validation & Test: DFT, BIST, post-silicon verification, reliability analysis
- Applications: IoT edge devices, biomedical implants, automotive/avionics systems, quantum computing interfaces
Submission Topics:
- VLSI design methodologies
- Analog/mixed-signal/RF ICs
- Digital signal processing ICs
- Low-power and ultra-low-voltage circuits
- Memory and storage systems
- Hardware accelerators for AI/ML
- 3D and heterogeneous integration
- ICs for biomedical applications
- Secure and trusted IC design
- Post-quantum cryptography hardware
- Test, verification and yield enhancement
- Sustainable IC manufacturing
Dr. Yu Guo
Dr. Yang Liu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Integrated circuits design
- VLSI systems
- AI hardware accelerators
- 3D integration
- low-power ICs
- mixed-signal circuits
- hardware security
- semiconductor test
- neuromorphic computing
- biomedical ICs
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