RF/Microwave Integrated Circuits Design and Application
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".
Deadline for manuscript submissions: 15 December 2026 | Viewed by 2570
Editors
2. College of Intelligent Science and Engineering, Qinghai Minzu University, Xining 810007, China
Interests: RF/microwave circuit design; circuit reliability design and analysis; circuit/die behavior modeling; electronic technology application
Interests: RF CMOS/GaAs/GaN IC design
Special Issue Information
Dear Colleagues,
With the full-scale deployment of 5G communications, the emergence of 6G research, and the rapid advancement of technologies such as the Internet of Things (IoT), autonomous driving, and satellite internet, the demand for high-performance, low-power, and miniaturized radio frequency (RF)/microwave integrated circuits has reached unprecedented levels. Advanced semiconductor processes (e.g., CMOS, SiGe, GaAs, GaN) have enabled the realization of RF front-end modules with higher frequencies and greater efficiency. This Special Issue aims to compile the latest research advances and innovative applications in the field of RF/microwave-integrated circuit design, addressing challenges and solutions from device modeling and circuit design to system integration. We cordially invite researchers from academia and industry to submit original research articles and reviews to collectively push the boundaries of this field.
The collection will usefully supplement (relate to) existing literature:
Option 1: Emphasizing a Technological Shift (e.g., towards 5G/6G and new applications)
This framing positions the Special Issue as essential for keeping up with rapid, application-driven technological changes.
Option 2: Emphasizing the Convergence of Technologies (e.g., Materials, AI, and Design)
This framing highlights how the Special Issue addresses the interdisciplinary nature of modern RF/MW IC design, which is a gap in more siloed existing literature.
Option 3: Emphasizing a Focus on "Systems-in-a-Package/Module" vs. Individual Circuits
This approach argues that the Special Issue addresses a move beyond individual block design to a higher level of integration, which is a key trend not yet comprehensively covered.
We welcome original and novel contributions, including research papers and extensive reviews, addressing the impact and relevance of RF/Microwave Integrated Circuits Design and Application.
We welcome submissions detailing new theories and evolutionary methods for RF/Microwave Integrated Circuits Design and Application. A non-exhaustive list of topics is as follows:
Design and Modeling Techniques:
- Design of high-performance low-noise amplifiers;
- Design of high-linearity and high-efficiency power amplifiers;
- Low-phase-noise voltage-controlled oscillators and frequency synthesizers;
- Mixers, modulators, and demodulators;
- RF switches, phase shifters, and attenuator circuits;
- Monolithic microwave integrated circuit design;
- Device modeling and simulation techniques for RF applications (e.g., BSIM-CMG, HB-FO).
Process and Integration Technologies:
- RF integrated circuits based on advanced CMOS and SiGe BiCMOS processes;
- Compound semiconductor (GaAs, GaN, InP) microwave integrated circuits;
- Millimeter-wave and terahertz integrated circuits for 5G/6G applications;
- RF micro-electro-mechanical systems and integrated passive devices;
- System-in-package and heterogeneous integration technologies.
Systems and Applications:
- 5G/6G transceiver chips and RF front-end modules;
- Phased array radar and beamforming chips;
- Satellite communication terminal chips;
- Automotive radar chips (76-81 GHz);
- Transceivers for IoT and wireless sensor networks;
- RF integrated circuits for biomedical applications.
Emerging and Interdisciplinary Areas:
- AI-assisted rf circuit design and optimization;
- Control circuits for reconfigurable intelligent surfaces and metasurfaces;
- Microwave control circuits for quantum information systems;
- RF energy harvesting and wireless power transmission chips.
Prof. Dr. Qian Lin
Prof. Dr. Fei You
Prof. Dr. Feng Feng
Guest Editors
Manuscript Submission Information
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Keywords
- RF/microwave integrated circuits
- low-noise amplifiers
- power amplifiers
- RF integrated circuits
- monolithic microwave integrated circuit
- compound semiconductor
- RF/microwave system-on-chip
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