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3D Computer Vision and 3D Reconstruction

This special issue belongs to the section “Computer Science & Engineering“.

Special Issue Information

Dear Colleagues,

The Special Issue aims to explore the latest advancements and innovations in the field of 3D computer vision and 3D reconstruction techniques. With the recent rapid development in computer science, electronic devices, optics, and related fields, 3D computer vision and reconstruction have hit their stride in recent years. These technologies inject new vitality into fields such as intelligent manufacturing, AR/VR display, and so on. Currently, there are substantial research-and-development efforts being made by academia and industry in this field. Accordingly, this Special Issue seeks to showcase research papers, communications, and review articles that focus on (1) 3D information acquisition and processing; (2) 3D reconstruction methods; (3) computer vision; (4) deep learning for 3D systems; and (5) emerging optical materials for 3D reconstruction.

  1. 3D information acquisition and processing;
  2. 3D reconstruction methods;
  3. Computer vision;
  4. Deep learning for 3D systems;
  5. Emerging optical materials for 3D reconstruction.

Dr. Yilong Li
Dr. Di Wang
Prof. Dr. Huan Deng
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 3D information acquisition and processing
  • 3D reconstruction methods
  • computer vision
  • deep learning for 3D systems
  • emerging optical materials for 3D reconstruction

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Electronics - ISSN 2079-9292