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Advances in Modeling Caloric Cooling Devices
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Advances in Modeling Caloric Cooling Devices

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Physics General".

Deadline for manuscript submissions: closed (20 November 2022) | Viewed by 8840

Special Issue Editor

Dr. Daniel Silva

E-Mail Website
Guest Editor
IFIMUP - Instute of Physics for Advanced Materials, Nanotechnology and Photonics, Faculty of Science of the Porto University, P-4169007 Porto, Portugal
Interests: magnetocaloric; thermal switch; refrigeration; finite element method; caloric; Python

Special Issue Information

Dear Colleagues,

We are inviting submissions to the Special Issue on Advances in Modeling Caloric Cooling Devices.

The current neccessity of finding ways to mitigate the effects of global warming, provoked by human activity, has led to a steep increase in the development of advanced heat-management systems. In this context, a considerable fraction of the innovative cooling systems being developed are caloric cooling devices. Due to the large number of possibilities regarding the development of caloric cooling cycles, modeling them is of paramount importance when designing effective systems. In this Special Issue, we invite submissions exploring the modeling of advanced cooling devices, including the use of caloric technologies such as magnetocaloric, electrocaloric, elastocaloric and barocaloric materials. Since the validation of developed models is critical, experimental works that include the modeling of one or more components of these systems are also welcome. This Special Issue accepts both survey papers and comprehensive reviews.

Dr. Daniel Silva
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers (2 papers)

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Research

17 pages, 609 KiB  
Article
Modeling the Transient Response of Thermal Circuits
by Daniel Silva
Appl. Sci. 2022, 12(24), 12555; https://doi.org/10.3390/app122412555 - 7 Dec 2022
Cited by 9 | Viewed by 6776
Abstract
Although stationary models for thermal circuits have been widely used, a direct analogy of transient responses of electric circuits to thermal systems is still difficult to establish. In this work, a thermal circuit model for transient responses is developed. The model states that [...] Read more.
Although stationary models for thermal circuits have been widely used, a direct analogy of transient responses of electric circuits to thermal systems is still difficult to establish. In this work, a thermal circuit model for transient responses is developed. The model states that each thermal object is a thermal resistance and a heat capacitor in parallel. The heat capacitor is the heat capacity of the overall material plus a correction term due to the thermal contacts of all thermal objects. The transient response of three basic thermal circuits is modeled, based on the proposed method, and validated, using the heatrapy Python package: single thermal resistance, two thermal resistances in series and two thermal resistances in parallel. A more complex model of a thermal circuit involving a heat source, a heat transfer medium and convection of heat to the surroundings is also developed and validated with data from literature of a thermal switch used in caloric cooling. The proposed method tackles computational issues introduced by the majority of numerical approaches. Full article
(This article belongs to the Special Issue Advances in Modeling Caloric Cooling Devices)
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14 pages, 1897 KiB  
Article
Thermal Response of Magnetic Refrigerants: Combined Effect of Temperature Dependent Specific Heat and Thermal Conductivity
by Antonio P. Lopes, Vitor A. F. Costa and Joao S. Amaral
Appl. Sci. 2022, 12(13), 6581; https://doi.org/10.3390/app12136581 - 29 Jun 2022
Viewed by 1484
Abstract
Device optimization plays a paramount role in current research on magnetic refrigeration. Solid state refrigerants have been characterized and numerical simulations assume a critical relevance in the development of magnetocaloric technology to have alternatives to vapour-compression systems whose operating elements have high global [...] Read more.
Device optimization plays a paramount role in current research on magnetic refrigeration. Solid state refrigerants have been characterized and numerical simulations assume a critical relevance in the development of magnetocaloric technology to have alternatives to vapour-compression systems whose operating elements have high global warming potential. Experimental studies have shown that the thermal properties of several magnetocaloric materials considerably change around their Curie temperatures (TC) and that this temperature dependency should not be dismissed. Current numerical research does not fully predict the complete thermal response of such materials, due to inaccuracies from neglecting the impact of combining both thermal conductivity (k) and specific heat (Cp) dependence on temperature. In this study, a simple unidimensional model includes k(T) and Cp(T) functions as input parameters, highlighting the relevance of considering temperature dependent thermophysical properties’ inputs when simulating the magnetic refrigerant’s heat transfer processes. The obtained results evidence that neglecting the temperature dependence of the magnetocaloric material thermophysical properties, namely its thermal conductivity and its specific heat, affects its temperature response, what may strongly affect the results after a succession of (hundreds or thousands) cycles. Full article
(This article belongs to the Special Issue Advances in Modeling Caloric Cooling Devices)
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