Integrated Photonics 2020: Sensing, Communication, Interconnection and Beyond

Dear Colleagues,

In the past decades, photonic integration has shown its potenial to miniaturize the optical systems with improved performance at a lower cost. A large number of functional devices have been developed on chip exploiting the CMOS-compatible silicon photonics platform or other variants such as InP and SiN materials. This implementation is promising in enhancing the functionality of photonical circuits with higher reliablity, which is eagerly desirable for various optical applications. As an example, high bandwidth devices and high throughput systems on the chip have been demonstrated with significant improvement for the energy efficiency data communications. Meanwhile, such technology development and advances have enabled a myriad of other applications including sensing, microwave photonics and data center interconnections. This Special Issue focuses on the state-of-the-art research exploiting the integrated photonics technology for advanced optical systems and novel applications. It will cover a variety of photonic integration related topics including biomedical systems, remote sensing, telecommunications, and on-chip interconnection, etc.

Dr. Peicheng Liao
Dr. Changjing Bao
Dr. Yang Yue
Prof. Zhongqi Pan
Prof. Odile Liboiron-Ladouceur
Guest Editor

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