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Applied Sciences
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Multi-Phase Flow and Heat Transfer
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Multi-Phase Flow and Heat Transfer

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Thermal Engineering".

Deadline for manuscript submissions: closed (31 December 2022) | Viewed by 4116

Special Issue Editor

Prof. Dr. Shiwei Zhang

E-Mail Website
Guest Editor
Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China
Interests: micro-nanostructures; thermal management; heat transfer; microchannels; vapor chambers

Special Issue Information

Dear Colleagues,

Thermal management plays critical role in a wide variety of electronical applications as their performance has increased and their physical space has decreased. As an efficient cooling method, two-phase heat transfer looks to be highly promising in the efficient thermal management of electronics to ensure their performance and reliability. However, many interdisciplinary scientific problems regarding two phase heat transfer still remain, including efficiency, reliability, durability, and the threshold of heat flux. Great efforts about two phase heat transfer enhancement have been made, such as rational designs for manipulating the liquid and vapor flow, wettability control for strengthening liquid supply, strategies for promoting the phase-change process, and so on. With the development of advanced theories and manufacturing techniques, novel two-phase heat transfer methods and their applications are continuously increasing. In this Special Issue, we welcome the contributions on two-phase heat transfer and their applications in the electronic field. We invite articles on theoretical and experimental studies on topics related to two-phase heat transfer, including but not limited to:

Boiling, evaporation, condensation, and related two-phase heat transfer processes;

Phase change heat transfer devices including heat pipe and vapor chamber, and related thermal control devices;

Thermal management in electronics applications;

Design, finite element analysis (FEA), and simulation of two-phase change heat transfer;

Liquid transport, desalination, and other related utilizations.

Prof. Dr. Shiwei Zhang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Boiling
  • Evaporation
  • Condensation
  • Sustainable cooling
  • Thermal management in electronics
  • Multi-Phase Flow
  • Two phase heat transfer devices
  • Liquid utilizations

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Published Papers (2 papers)

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Research

20 pages, 8019 KiB  
Article
Transient Cooling of Millisecond-Pulsed Heat Sources by a Jet Impingement Heat Sink with Metallic Phase Change Material
by Liang Chen, Qi Wang, Yansong Si and Yu Hou
Appl. Sci. 2023, 13(3), 1812; https://doi.org/10.3390/app13031812 - 31 Jan 2023
Cited by 1 | Viewed by 1891
Abstract
Thermal management has become a critical issue for the reliable operation of electronic devices, especially for pulsed heat sources with high heat flux. The intense temperature rise in a short period puts forward high requirements on thermal management. In this work, a heat [...] Read more.
Thermal management has become a critical issue for the reliable operation of electronic devices, especially for pulsed heat sources with high heat flux. The intense temperature rise in a short period puts forward high requirements on thermal management. In this work, a heat sink combining the confined jet impingement with metallic phase change material (PCM) is proposed for the thermal management of millisecond-pulsed heat sources. A transient model is established to simulate the conjugated heat transfer. The heat transfer characteristics of a jet impingement heat sink and the temperature responses under millisecond heat pulses are obtained, and the effects of jet structure and metallic PCM thickness on the cooling performance are analyzed. Results show that the jet impingement with a jet diameter of 2 mm and an impingement height of 2 mm can achieve effective cooling on a 3 × 3.5 mm2 heat source, and the surface temperature is 62.2 °C for a constant power density (150 W/cm2). Under the millisecond heat pulses with a peak power density of 600 W/cm2 and a duty cycle of 0.25, the temperature on the heating surface fluctuates in the same period with the heat pulses, and the maximum temperature reaches 66.9 °C for a heat sink without metallic PCM. An appropriate PCM thickness should be smaller than 0.1 mm so that the phase change can be cycled within heat pulse intervals, and the maximum temperature can be maintained around the phase change temperature (61.5 °C). Full article
(This article belongs to the Special Issue Multi-Phase Flow and Heat Transfer)
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15 pages, 3309 KiB  
Article
Experimental Investigation on a Novel Necking Heat Pipe with Double-End Heating for Thermal Management of the Overload Operation
by Jie Li, Shiwei Zhang, Heng Tang, Yifu Liang, Sheng Wang, Guisheng Zhong and Yong Tang
Appl. Sci. 2022, 12(22), 11661; https://doi.org/10.3390/app122211661 - 16 Nov 2022
Cited by 1 | Viewed by 1629
Abstract
This work proposed a novel necking heat pipe with double-end heating for thermal management of the overload operation. The addition of another heat load was adopted to obtain a higher threshold critical power for the heat pipe system. The thermal performance of thermal [...] Read more.
This work proposed a novel necking heat pipe with double-end heating for thermal management of the overload operation. The addition of another heat load was adopted to obtain a higher threshold critical power for the heat pipe system. The thermal performance of thermal switch heat pipe (TSHP) and traditional grooved heat pipe (TGHP) was investigated experimentally, including the threshold critical power, starting characteristic, recovery characteristic, surface temperature distribution, thermal resistance, etc. The optimized TSHP exhibited a larger threshold critical power range with low additional heat load input (from 55 W to 65 W, almost 20% increase), low starting additional heat load input (2 W), good recovery characteristic (less than 150 s from 75 °C to normal after overload), and low thermal resistance with additional heat load input (less than 0.13 °C/W). These results indicate that the optimized TSHP can offer great potential for the overload operation situation with the additional heat load. Such a novel necking heat pipe with double-end heating can be utilized in heat pipe systems to obtain different thermal performances for complicated working situations, especially for the overload operation situation. Full article
(This article belongs to the Special Issue Multi-Phase Flow and Heat Transfer)
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