Chemical Mechanical Polishing and Grinding

Today, polishing and grinding technologies are applied in a variety of fields and add value to products. Beyond traditional processing methods, various types of polishing and grinding techniques have been developed and applied to industrial sites. Although polishing and grinding techniques have been commercialized for a long time, there is still the possibility of developing them academically and technically. We are inviting manuscripts for this Special Issue on “Chemical Mechanical Polishing (CMP) and Grinding”, which aims to cover the latest technologies in the field. Some of the specific topics for this Special Issue include:

• Mechanism studies on material removal;
• Advanced CMP, polishing, grinding, lapping technologies;
• Application of CMP and grinding;
• Modeling and simulation;
• Studies on CMP and grinding consumables;
• Process monitoring.

We look forward to your submissions to this Special Issue in any form, including review articles and regular research articles.

Prof. Dr. Hyunseop Lee
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the Special Issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.