- Article
Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems
- Florian Thoma,
- Frank Goldschmidtböing,
- Keith Cobry and
- Peter Woias
In this article, a novel Pyrex reflow bonding technology is introduced which bonds two functional units made of silicon via a Pyrex reflow bonding process. The practical application demonstrated here is a precision dosing system that uses a mechanica...

