- Article
Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization
- Dmitry A. Baklykov,
- Mihail Andronic,
- Olga S. Sorokina,
- Sergey S. Avdeev,
- Kirill A. Buzaverov,
- Ilya A. Ryzhikov and
- Ilya A. Rodionov
Advanced microsystems widely used in integrated optoelectronic devices, energy harvesting components, and microfluidic lab-on-chips require high-aspect silicon microstructures with a precisely controlled profile. Such microstructures can be fabricate...