Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization
Baklykov, D.A.; Andronic, M.; Sorokina, O.S.; Avdeev, S.S.; Buzaverov, K.A.; Ryzhikov, I.A.; Rodionov, I.A. Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization. Micromachines 2021, 12, 534. https://doi.org/10.3390/mi12050534
Baklykov DA, Andronic M, Sorokina OS, Avdeev SS, Buzaverov KA, Ryzhikov IA, Rodionov IA. Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization. Micromachines. 2021; 12(5):534. https://doi.org/10.3390/mi12050534
Chicago/Turabian StyleBaklykov, Dmitry A., Mihail Andronic, Olga S. Sorokina, Sergey S. Avdeev, Kirill A. Buzaverov, Ilya A. Ryzhikov, and Ilya A. Rodionov. 2021. "Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization" Micromachines 12, no. 5: 534. https://doi.org/10.3390/mi12050534