Low-Dimensional Materials and Applications in Electronics

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 31 May 2026 | Viewed by 321

Special Issue Editors


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Guest Editor
Department of Electrical and Computer Engineering, Duke University, Durham, NC 27708, USA
Interests: atomic layer etching; interconnects and packaging; graphene synthesis and electronics; chemical vapor deposition; quantum devices
Special Issues, Collections and Topics in MDPI journals

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Guest Editor Assistant
Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA
Interests: oxide semiconductor; CNT; 2D; BEOL-compatible materials and devices; DTCO

Special Issue Information

Dear Colleagues,

Scope and Topics

Low-dimensional materials, including quantum dots, nanowires, two-dimensional (2D) materials, and one-dimensional (1D) nanostructures, represent a transformative frontier in modern electronics. These materials exhibit unique electronic, optical, and mechanical properties that arise from quantum confinement effects and reduced dimensionality, opening unprecedented opportunities for next-generation electronic devices and systems.

This Special Issue invites high-quality research contributions that advance our understanding of low-dimensional materials and their electronic applications. We seek original research articles, comprehensive reviews, and perspectives that address both fundamental science and practical applications.

Topics of interest include, but are not limited to, the following:

Materials and Synthesis:

  • Two-dimensional materials (graphene, transition metal dichalcogenides, MXenes, phosphorene, borophene);
  • One-dimensional nanomaterials (carbon nanotubes, semiconductor nanowires, quantum wires);
  • Zero-dimensional systems (quantum dots, nanoparticles, molecular electronics);
  • Heterostructures and van der Waals assemblies;
  • Novel synthesis methods and scalable fabrication techniques.

Electronic Properties, Characterization, and Modeling:

  • Quantum confinement effects and band structure engineering;
  • Carrier transport mechanisms and mobility studies;
  • Electronic and optoelectronic properties;
  • Thermal conductivity and reliability;
  • Spin and valley electronics (spintronics, valleytronics);
  • Advanced characterization techniques and in-situ measurements.

Electronic Applications:

  • Field-effect transistors and logic devices;
  • Memory devices and neuromorphic computing;
  • Sensors and biosensors;
  • Flexible and transparent electronics;
  • Energy harvesting and storage devices;
  • Quantum electronic devices;
  • High-frequency and terahertz electronics;
  • Electronic packaging and interconnection.

Integration and Processing:

  • Device fabrication and processing challenges;
  • Integration with conventional semiconductor technology;
  • Interface engineering and contact optimization;
  • Reliability and stability studies;
  • Manufacturing scalability and commercialization aspects.

Dr. Haozhe Wang
Guest Editor

Dr. Shengman Li
Guest Editor Assistant

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Keywords

  • 2D materials
  • 1D materials
  • zero-dimensional systems
  • electronic
  • optoelectronic
  • MXene
  • characterization techniques
  • field-effect transistors
  • memory devices
  • biosensors
  • high-frequency and terahertz electronics
  • semiconductor technology

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Published Papers (1 paper)

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Research

14 pages, 4404 KB  
Article
The Influence of Pulsed Superimposed DC Electric Field Synergistically Inducing Orientation Arrangement of BNNSs on Thermal Properties of Epoxy Composites
by Xiaopeng Wang, Songyuan Li, Zhen Yin, Qi Zhang, Lei Deng, Yiqin Peng and Yan Mi
Micromachines 2025, 16(10), 1126; https://doi.org/10.3390/mi16101126 - 30 Sep 2025
Viewed by 230
Abstract
Modern power systems require better heat dissipation and thermal stability, but traditional low-filler composites cannot significantly enhance thermal conductivity. To address this issue, electric field induction technology orientation can efficiently orient boron nitride nanosheets (BNNSs), thereby improving the thermal conductivity of epoxy composites [...] Read more.
Modern power systems require better heat dissipation and thermal stability, but traditional low-filler composites cannot significantly enhance thermal conductivity. To address this issue, electric field induction technology orientation can efficiently orient boron nitride nanosheets (BNNSs), thereby improving the thermal conductivity of epoxy composites composed of BNNSs as the thermally conductive filler. In this study, an innovative approach employing a pulsed superimposed direct current (DC) electric field to synergistically induce filler orientation is used to construct efficient thermally conductive channels. The study found that the thermal conductivity of the composite prepared by superimposing an 8 kV/mm pulsed electric field on a 30 V/mm DC electric field is about 0.474 W/(m·K), which is 34.66% higher than that prepared by only a pulsed-induced field and 17.5% higher than the theoretical superposition value. Similarly, the composite prepared by superimposing a 4 kV/mm pulsed electric field on a 70 V/mm DC electric field increased to about 0.464 W/(m·K), which is 27.47% higher than that prepared by only a DC-induced field and 12.4% higher than the theoretical superposition value. These results indicate that the superimposed electric field treatment synergistically improves the thermal conductivity of the composite. Compared to other materials, composites prepared using the superimposed pulsed and DC electric field induction also exhibit superior thermal stability. This strategy effectively addresses the issue of material thermal aging caused by insufficient thermal conductivity, providing innovative ideas and a solid theoretical foundation for material design and thermal management. Full article
(This article belongs to the Special Issue Low-Dimensional Materials and Applications in Electronics)
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