Advanced Flexible Electronic Devices for Biomedical Application

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "B:Biology and Biomedicine".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 39

Special Issue Editors


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Guest Editor
Frontiers Science Center for Flexible Electronics (FSCFE), Institute of Flexible Electronics (IFE), Northwestern Polytechnical University (NPU), 127 West Youyi Road, Xi’an 710072, China
Interests: biomedical hydrogel; hydrogel-based devices

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Guest Editor
Department of Physics, Kyungpook National University, 80 Daehak-ro, Bukgu, Daegu 41566, Republic of Korea
Interests: optics; laser processing; nano-processing; flexible/wearable electronics; transparent display; energy devices
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Special Issue Information

Dear Colleagues,

The rapid evolution of flexible electronics has unlocked transformative possibilities in biomedical engineering, enabling innovative solutions for healthcare monitoring, diagnostics, and therapeutic interventions. This Special Issue seeks to highlight cutting-edge research at the intersection of materials science, electronics, and biomedicine. We invite contributions exploring novel flexible and stretchable materials, advanced fabrication techniques, and bio-integrated systems such as wearable sensors, implantable devices, and smart prosthetics.

Topics of interest include biocompatible interfaces, energy-efficient designs, real-time physiological signal monitoring, and AI-enhanced data processing for personalized healthcare. Submissions addressing scalability, long-term stability, and clinical translation are particularly encouraged.

By bridging technological innovation with medical needs, this issue aims to foster interdisciplinary collaboration and accelerate the development of next-generation biomedical tools that enhance patient outcomes, reduce healthcare costs, and expand accessibility. Researchers worldwide are invited to submit original articles, reviews, and perspectives that advance the frontiers of flexible electronics in biomedicine. By bringing together recent discoveries and technological developments, this Special Issue aims to shape the future of advanced flexible electronic devices for healthcare monitoring, diagnostics, and therapeutic interventions.

Dr. Yueying Yang
Prof. Dr. Junyeob Yeo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible or stretchable electronics
  • wearable sensors
  • implantable devices
  • smart prosthetics
  • bioelectronics
  • flexible electronic materials
  • advanced fabrication techniques
  • bio-integrated systems

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Published Papers

This special issue is now open for submission.
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