Materials and Devices for Advanced Thermal Energy Harvesting and Management

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: 31 May 2026 | Viewed by 5

Special Issue Editor


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Guest Editor
Henry M. Rowan College of Engineering, Rowan University, Glassboro, NJ 08028, USA
Interests: thermoelectric; materials synthesis and processing; microwave; thermal management

Special Issue Information

Dear Colleagues,

The ever-increasing demand for energy, coupled with concerns about climate change and greenhouse gas emissions, urgently obliges us to find more sustainable energy resources and develop innovative methods for clean energy generation. Annually, approximately 70% of global energy consumption dissipates as waste heat, predominantly from industrial processes, commercial buildings, residential sources, and transportation. This makes waste heat one of the largest, yet largely unexploited, energy sources. Recovering even a fraction of this waste heat, alongside developing clean energy generation and thermal management techniques, could profoundly transform our energy future and significantly impact human society.

Accordingly, this Special Issue invites research papers, short communications, and review articles focusing on (1) novel design, fabrication, processing, and applications of thermoelectric materials and devices; (2) advanced thermal energy harvesting techniques, including thermoelectric, thermomagnetic, and pyroelectric materials and devices; and (3) advanced solid-state cooling and thermal management techniques, such as Peltier coolers, phase change materials, thermal capacitors, thermal rectifiers, and thermal diodes.

Dr. Amin Nozariasbmarz
Guest Editor

Manuscript Submission Information

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Keywords

  • thermoelectric materials and devices
  • waste heat recovery
  • thermal management
  • body power harvesting
  • thermoelectric generators
  • thermoelectric coolers
  • thermal energy harvesting
  • phase change materials
  • thermomagnetic materials
  • pyroelectric materials

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Published Papers

This special issue is now open for submission.
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