Advances in Diffusion Bonding of Metallic Materials

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Welding and Joining".

Deadline for manuscript submissions: 30 September 2024 | Viewed by 35

Special Issue Editor

Prof. Dr. Amir Shirzadi
E-Mail Website1 Website2
Guest Editor
1. School of Engineering and Innovation, The Open University, Milton Keynes MK7 6AA, UK
2. Cambridge Joining Technology, Cambridge, UK
Interests: developing new methods for diffusion bonding un-weldable materials; designing new weld alloys capable of reducing residual stresses

Special Issue Information

Dear Colleagues,

Welding techniques are generally classified into two categories: fusion welding processes (e.g., arc/laser welding) and solid-state welding processes (e.g., forge welding). Diffusion bonding, as a subdivision of both solid-state welding and liquid-phase welding, is a joining process wherein the principal mechanism is the interdiffusion of atoms across the interface. Diffusion bonding enables the joining of materials and fabrication of complex components for which conventional welding processes have proven unsuccessful.

Original submissions in the following five categories will be considered for publication in the Metals Special Issue on diffusion bonding:

1—Joining un-weldable dissimilar alloys, e.g., titanium to aluminium and tungsten to copper;
2—Joining materials sensitive to melting or high temperatures, e.g., metal matrix composites (MMC) and oxide dispersion strengthened (ODS) alloys;
3—Joining metals to ceramics, e.g., aluminium to sapphire and steel to structural glass;
4—Joining similar or dissimilar non-metallic materials, e.g., cemented carbides and polymers;
5—Joining high-precision components which require maintaining the original shape and dimensions of the parts, e.g., electronic devices and microwave guides.

The submitted manuscripts will be checked against the following conditions prior to the peer-reviewing stage.

I: Articles investigating bond microstructures should include the results of appropriate mechanical tests, conducted to assess the join integrity;
II: Articles on the modelling of diffusion bonding should include an experimental validation of the modelling outcome;
III: Review articles must contain a critical assessment of, rather than simply outlining, previous work in the field.

Prof. Dr. Amir Shirzadi
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • diffusion bonding
  • transient liquid phase (TLP) bonding
  • joining dissimilar materials
  • joining metals to ceramics
  • high-precision welding

Published Papers

This special issue is now open for submission.
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