Microstructural Characteristics and Mechanical Behavior of Particle-Reinforced Copper-Based Composites

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: closed (15 February 2025) | Viewed by 250

Special Issue Editor


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Guest Editor
Institute of Engineering Research, Jiangxi University of Science and Technology, Ganzhou 341000, China
Interests: control of microstructure and properties of high-strength and high-conductivity copper alloys; preparation and characterization of microstructure and properties of high-performance metal matrix composites; research and development of copper materials for new energy applications

Special Issue Information

Dear Colleagues,

Particle-reinforced copper-based composites combine the electrical and thermal conductivity of copper with the hardness and wear resistance of reinforcement phases, presenting important application value in such fields as transportation, electronic information, aerospace, and energy engineering. The scope for this Special Issue includes the innovative preparation method, especially that with advantages of high efficiency and low cost. Particular attention should be paid to microstructure and interface characteristics, which have a decisive influence on the final properties of the material.

In this Special Issue, we welcome articles that focus on material preparation methods and their influence on the microstructure and comprehensive performance. Effective microstructure control remains of high interest, containing not only a traditional uniform structure, but also composites with nonuniform architectures, such as hierarchical, harmonic, laminate, and co-continuous structures.

Dr. Jianbo Zhang
Guest Editor

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Keywords

  • copper
  • metal matrix composites
  • microstructures
  • interface
  • reinforcement
  • microstructural architecture

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Published Papers (1 paper)

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Research

22 pages, 4762 KiB  
Article
Research on the Structure and Mechanical Properties of Mesh Powder Composite Copper Microporous Materials
by Liuyang Duan, Zhiwen Zhao and Wuyi Ming
Metals 2025, 15(5), 498; https://doi.org/10.3390/met15050498 (registering DOI) - 29 Apr 2025
Abstract
With the proliferation of flexible electronics, the advancement of mechanically compliant thermal management systems, notably flexible heat pipes, is imperative to address evolving demands for adaptive thermal regulation in deformable device architectures. The wicks of heat pipes commonly utilize porous copper. In this [...] Read more.
With the proliferation of flexible electronics, the advancement of mechanically compliant thermal management systems, notably flexible heat pipes, is imperative to address evolving demands for adaptive thermal regulation in deformable device architectures. The wicks of heat pipes commonly utilize porous copper. In this study, three types of porous copper materials were fabricated: sintered pure copper powder, sintered copper powder with a copper mesh (as a reinforcing network), and sintered copper powder with NaCl (as a pore-forming agent). Their pore structure characteristics, tensile, and compressive mechanical properties were systematically investigated. Results demonstrated that incorporating NaCl into copper powder significantly increased porosity and enlarged pore size, thereby enhancing permeability. For instance, compared to sintered pure copper powder, the addition of NaCl increased the average pore diameter from 0.31 μm to 2.44 μm and improved permeability from 1.908 × 10−14 m2 to 2.832 × 10−12 m2, effectively reducing fluid flow resistance. The introduction of copper mesh notably improved mechanical performance: under a sintering temperature of 900 °C, tensile strength increased from 121.6 MPa to 132.2 MPa, and compressive strength rose from 443.5 MPa to 458.4 MPa. However, NaCl-added porous copper exhibited a drastic decline in tensile strength. Consequently, NaCl-modified porous copper is unsuitable for flexible wick applications, whereas copper mesh-reinforced porous copper shows potential as a flexible wick, though further investigation is required to enhance its permeability mechanisms. Full article
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