Mechanical Behaviors and Damage Mechanisms of Metallic Materials

Dear Colleagues,

It is well known that metallic materials are widely used in many traditional and advanced engineering sectors, e.g., civil and ship constructions, automotive, manufacturing, aeronautics, and aerospace, to name just a few.

Considering their possible applications, metals and alloys have to withstand various combinations of loading and environmental conditions, e.g., static or dynamic (fatigue, impact) loadings, at room or high temperature, sometimes in the presence of aggressive or corrosive environments. Each environment/loading combination triggers a specific mechanical response (elastic, plastic, creep, fatigue, ratcheting, wear, fretting, etc.) and makes materials more susceptible to a certain damage mechanism, which in some cases may even lead to catastrophic failure. An in-depth understanding of the different types of mechanical behaviors and damage mechanisms of metals and alloys is of paramount importance to achieve a flawless engineering design.

Based on these insights, this Special Issue aims not only to provide an up-to-date overview on the relevant mechanical behaviors, deformation, and damage mechanisms of metallic materials under various environmental/loading conditions, but also to collect original contributions exemplifying standard or more advanced analysis techniques. This focus is wide-ranging as it includes, but it is not limited to, the characterization of mechanical responses, deformation types, and micro and macro damage mechanisms of traditional and advanced metallic materials under simple and complex loadings.

Researchers are kindly invited to submit original or review articles in which aspects of mechanical behavior and the damage mechanisms of metallic materials are analyzed and discussed through theoretical and/or numerical approaches, or illustrated by experiments or case studies.

Prof. Dr. Denis Benasciutti
Prof. Dr. Luis Reis
Guest Editors

Dr. Julian M. E. Marques
Assistant Guest Editor

Manuscript Submission Information

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