Microstructural and Mechanical Characteristics of Welded Joints
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".
Deadline for manuscript submissions: 20 November 2025 | Viewed by 15
Special Issue Editors
Interests: electronic packaging; solder joint; reliability; interfacial metallurgy
Special Issue Information
Dear Colleagues,
This Special Issue aims to explore the latest research and developments in the field of electronic packaging, with a particular focus on solder joints, reliability, and interfacial metallurgy. It emphasizes friction stir welding/processing, dissimilar metal joining, and additive manufacturing. It seeks to provide a comprehensive platform for researchers and engineers to share their findings and insights on these aspects. This Special Issue covers both theory and practice, aiming to deepen understanding, promote innovation, and drive interdisciplinary breakthroughs that connect basic research with industrial application.
Dr. Jie Wu
Dr. Guoqiang Huang
Guest Editors
Manuscript Submission Information
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Keywords
- electronic packaging
- solder joint
- reliability
- interfacial metallurgy
- friction stir welding/processing
- dissimilar metal joining
- additive manufacturing
- microstructure
- properties
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