Special Issue "Volume II: Semiconductor Power Devices"
Deadline for manuscript submissions: closed (30 June 2019).
Guest Editorial Board:
- Marina Antoniou, University of Cambridge, UK
- Chih-Fang Huang, National Tsing Hua University, Taiwan
- Ferdinando Iucolano, ST Microelectronics, Italy
- Pete Losee, UnitedSiC, USA
- Andrei Mihaila, ABB, Switzerland
- Takafumi Okuda, Kyoto University, Japan
- Martin Pfost, TU Dortmund, Germany
- Michele Riccio, University of Naples “Federico II”, Italy
- Frederic Richardeau, CNRS, University of Toulouse, France
- Akio Shima, Hitachi, Japan
- Kenichiro Tanaka, Panasonic, Japan
Wide-band-gap (WBG) semiconductors enable a radical change in the optimization trade-offs typical of power device design. For instance, fully-drift-current-based high voltage (>600 V) components with good on-state performance and excellent switching capability are feasible and have been amply demonstrated. Bipolar solutions, on the other hand, enable achievement of unprecedented ultra-high voltage ratings (>10 kV), opening up radically new system level development options; a number of research samples have been presented over the past few years, too. In addition, WBG technology offers high temperature operation capability, and, with it, the potential for disruptive progress beyond state-of-the-art in the volumetric and gravimetric power density that can be realistically targeted in the development of power conversion systems.
Over the past few years, the technology has transitioned from a research exercise to a commercial reality in the instance of silicon carbide (SiC) and gallium nitride (GaN), while other materials have further developed (e.g., diamond, C) or have been newly introduced (gallium oxide, Ga2O3). While it is yet not fully clear where WBG will replace silicon (Si) and where they will co-exist, some application domains pivotal of societal infrastructure are by now acknowledged as strategically relevant for its large market deployment. At the same time, a number of aspects still require dedicated attention, including the development of bespoke packaging solutions, reliability enhancement and lifetime assessment and validation methodologies.
This Special Issue aims to gather contributions defining the state-of-the-art in WBG power device design, fabrication technology, packaging and thermal management, application and reliability validation: Original contributions and review papers alike are solicited in all relevant areas.
Dr. Alberto Castellazzi
Dr. Andrea Irace
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Silicon carbide (SiC)
- Gallium nitride (GaN)
- Gallium Oxide (Ga2O3)
- Diamond (C)
- semiconductor power devices
- power converters
- power modules
- thermal management/cooling