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Energies
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Heat Transfer and Thermoelectric Generator
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Heat Transfer and Thermoelectric Generator

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J1: Heat and Mass Transfer".

Deadline for manuscript submissions: closed (20 March 2025) | Viewed by 1539

Special Issue Editor

Dr. Grzegorz Nowak

E-Mail Website
Guest Editor
Department of Power Engineering and Turbomachinery, Silesian University of Technology, 44-100 Gliwice, Poland
Interests: FEM analyses; turbomachinery; thermomechanics; thermoelectrics; thermoacoustics; mechanical vibration
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are pleased to extend an invitation to you to contribute to an important field of study, namely the transfer of heat and the generation of electricity via thermoelectric effects. This interdisciplinary field of study connects thermal dynamics with electrical engineering, thereby providing a platform for addressing global energy challenges and fostering technological innovation.

This topic is significant for two reasons. Firstly, it offers a distinctive prospect for pioneering research. Secondly, it addresses a pivotal issue in the domain of thermal and electrical engineering. The transfer of heat is of critical importance to a number of applications, including climate control systems and industrial processes. Furthermore, it is of vital importance in thermoelectric systems. Your research could facilitate the discovery of novel techniques to augment heat transfer efficacy and enhance thermal management.

The utilisation of thermoelectric generators enables the conversion of waste heat into electrical energy, thereby enhancing energy efficiency and reducing the environmental impact. By investigating innovative materials and TEG/TEC designs, there is the potential to advance this technology and expand its applications, including waste heat recovery, remote power generation, and thermal management.

Submissions on a wide range of topics within this field are encouraged, including, but not limited to:

  • The field of thermoelectric materials.
  • The exploration of novel techniques and technologies to improve heat conduction, convection, and radiation.
  • Presentation of new designs, performance analyses, and strategies for optimising thermoelectric generators and coolers.
  • TEG/TEC system design and optimisation.
  • Sharing of practical implementations, real-world applications, and case studies related to heat transfer and TEGs.
  • The development of theoretical frameworks and computational models that advance our knowledge of heat transfer and thermoelectric effects

Dr. Grzegorz Nowak
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermoelectric materials
  • novel techniques and technologies to improve heat conduction, convection, and radiation
  • thermoelectric generators and coolers
  • heat transfer and TEGs

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (2 papers)

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Research

17 pages, 825 KiB  
Article
Enhanced Performance of a Thermoelectric Module with Heat Pipes for Refrigeration Applications
by Majed A. Alrefae
Energies 2025, 18(10), 2426; https://doi.org/10.3390/en18102426 - 8 May 2025
Abstract
Thermoelectric module (TEM)-based coolers are gaining traction as compact, portable refrigeration solutions for storing medicine, beverages, and food. However, their adoption has been limited by relatively low cooling power and efficiency. This study demonstrates the importance of heat transfer in enhancing the coefficient [...] Read more.
Thermoelectric module (TEM)-based coolers are gaining traction as compact, portable refrigeration solutions for storing medicine, beverages, and food. However, their adoption has been limited by relatively low cooling power and efficiency. This study demonstrates the importance of heat transfer in enhancing the coefficient of performance (COP) of TEMs through optimizing their boundary conditions. Among the three boundary conditions evaluated, the most effective involved integrating heat pipes (HPs) with a cooling fan on both sides of the TEM. This configuration significantly improved thermal management, enabling the system to achieve a COP of 0.53, with a cooling rate of 26.26 W and a cold-side temperature of 278.5 K. The enhanced heat extraction from the hot side, reaching 61.94 W, reduced the hot-side temperature to 305.6 K and decreased the overall thermal resistance, confirming the critical role of active heat dissipation. Moreover, placing a cooling fan on the HPs is crucial for facilitating efficient heat transfer from the hot side with a lower thermal resistance, as confirmed via thermal resistance analysis. Furthermore, a prototype refrigerator based on the TEM with HPs was built and tested indoors and outdoors with a COP of 0.45, a cooling rate of 21.97 W, and a cold-side temperature of 271.0 K. This study shows that the COP of TEMs can be increased by applying HPs to reduce the total thermal resistance of the TEM sides. Further optimization of TEM-based refrigerators holds promise for improving their performance in sustainable, small-scale cooling applications. Full article
(This article belongs to the Special Issue Heat Transfer and Thermoelectric Generator)
24 pages, 14461 KiB  
Article
Thermal Management of Cubesat Subsystem Electronics
by Kacper Kuta, Grzegorz Nowak and Iwona Nowak
Energies 2024, 17(24), 6462; https://doi.org/10.3390/en17246462 - 22 Dec 2024
Viewed by 1190
Abstract
The temperature field of an electronic optical instrument can affect the image quality realised by the instrument and, in extreme cases, lead to damage. This is particularly true for instruments operating in harsh environments such as space. The hyperspectral imaging optical instrument (OI) [...] Read more.
The temperature field of an electronic optical instrument can affect the image quality realised by the instrument and, in extreme cases, lead to damage. This is particularly true for instruments operating in harsh environments such as space. The hyperspectral imaging optical instrument (OI) designed for the Intuition-1 (I-1) nanosatellite, currently in low Earth orbit, has been subjected to a numerical analysis of its thermal state under different operating conditions, and some preliminary experimental tests have been carried out to determine the maximum operating temperatures of its sensitive components and the risk of thermal damage. This work was part of a testing campaign prior to the deployment of Intuition-1. Three operational cases were analysed: (1) behaviour in the Earth’s atmospheric conditions when the OI is pointed at the Sun, (2) the end of the de-tumbling process in orbit with the Sun crossing the diagonal of the OI’s field of view, and (3) identification of the maximum possible number of consecutive Earth imaging cycles in orbit. The ultimate goal of this work was to validate the numerical approach used for these cases and to deepen the understanding of the thermal safety of the CMOS image sensor placed in the OI. For these cases, transient thermal field analyses were performed for the OI to determine the temperature distribution and its variability in the most thermally sensitive CMOS image sensor. The components of the OI and its overall structure were experimentally tested, and the results were used to validate the numerical models. The study showed that the built-in temperature sensor does not always reflect the actual CMOS temperature, and in some extreme cases the current temperature monitoring does not ensure its safe operation. Full article
(This article belongs to the Special Issue Heat Transfer and Thermoelectric Generator)
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