Special Issue "Applications of Thin Films in Microelectronics"
Deadline for manuscript submissions: 31 January 2022.
Interests: flexible and wearable electronics and applications; Site-selective laser processing (annealing, sintering, direct laser writing, plasmonic welding, interference, etc.); micro/nanoscale thermal/heat transfer analysis; polymer like hyperelastic non-linear behavior analysis (e.g. stress, strain) for stretchable and flexible structure; electronic and optoelectronic device applications of 2D materials; device physics for semiconductor devices based on thin-film transistors platform; solution processed low-cost printing technologies and development (e.g. screen, inkjet, roll-to-roll, gravure, etc.); 3D hierarchical mechanical metamaterial structure and system
Thin films formed by lots of different approaches are being used in various applications for microelectronics (e.g., transistors, sensors, batteries, energy devices, actuators, coatings) due to their versatility. Furthermore, the electronics industry has become the greatest beneficiary of thin film technology, which contributes to the development of microelectronics by reducing the sizes of semiconductor devices. These thin film devices are more essentially designed, with outstanding mechanical deformability, sensitive-to-multifunctional responses, and intelligent control capabilities. As thin films technology is a multidisciplinary field, thin films studies have directly or indirectly caused the advancement of many new areas of research and will continue to play increasingly important roles in the study of a variety of problems of basic and technological importance. Therefore, by interacting with diverse perspectives, knowledge of the nature, functions, and new properties of thin films can be used for the development of new technologies for future applications in microelectronics.
The main aim of this Special Issue is to seek high-quality submissions that highlight emerging applications, materials synthesis, and the fabrication process, which address recent breakthroughs in the microelectronic system. The topics of interest include but are not limited to:
- Searching and investigating various types of applications of thin films in electronics;
- Advanced fabrication processes and characterizations;
- Research into new synthesis methods;
- Analysis of film behaviors;
- Robust and reliable novel geometrical designs in microelectronics.
Dr. Hyuk-Jun (Jaden) Kwon
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Applications of thin films in electronics
- Low dimension materials
- Advanced fabrication processes
- Analysis of film behaviors (Physical and chemical)
- Robust and reliable structural design
- Characterizations of thin films
- New synthesis approach