Special Issue "Microelectronics Reliability"
Deadline for manuscript submissions: 30 November 2021.
Interests: semiconductor reliability; DRAM test and reliability; radiation effects
With the advent of life-critical technologies such as autonomous vehicles, microelectronics’ reliability and requirements have increased in modern electronics. Recent research in reliability areas has rapidly expanded from low-level devices such as diodes and transistors to the reliabilities of various aspects of products: components, systems, and manufacturing processes. Microelectronics’ reliability should not be handled as a standalone issue that mainly deals with device degradation due to structural changes in materials (i.e., fundamental mechanism-oriented reliability). In order to overcome the challenges from emerging technologies that deal with life and security data, reliability topics should be perceived and researched as problems in combinations of associated devices, circuits, systems, and even system software. Such a multilevel approach of integrating devices into systems is essential. The goal of this Special Issue of Electronics is to present state-of-the-art investigations on various reliability technologies and cover all levels of integrated systems and manufacturing:
- materials and processes;
- technologies (CMOS, BiCMOS, etc.);
- components (SRAM, DRAM, sensors, power electronics, etc.);
- integrated circuits (processors, controllers, etc.);
- integrated systems (communication, graphic module, etc.); and
Topics of interest on reliability include, but are not limited to:
- traditional reliability topics (TDDB, HCT, EM, etc.);
- life testing;
- accelerated testing;
- failure mechanisms;
- case studies of physical failures;
- mitigation (proactive and passive);
- reliability models;
- stress mechanisms;
- interconnection issues;
- reliability due to radiation effects;
- telemetry, on-die sensors, and instant health monitoring for fast reliability loops.
Prof. Dr. Sanghyeon Baeg
Dr. Shi-Jie Wen
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- semiconductor reliability
- failure mechanisms
- reliability models
- physical failure
- stress mechanisms
- radiation effects
- telemetry on-die sensors, instant health monitoring for fast reliability loops