Advances in Inspection and Sensing Technologies

Dear Colleagues,

High-performance inspection and sensing technologies have become key enablers for advanced manufacturing, especially in the industries of semiconductor, consumer electronics, precision engineering, and fast-moving consumer goods (FMCG). As the frontier of data collection, these technologies are also the critical elements for Industry 4.0.

Inspection and sensing technologies have seen rapid development in the recent decade, driven by emerging concepts in the areas of electronics, optics, quantum physics, digitalization, and artificial intelligence.
As inspection and sensing applications involve multi-discipline topics, this Special Issue will welcome researchers from different areas to contribute high-quality submissions. The topics of interest will include, but not be limited to, the following:

• Intelligent inspection
• Sensing technologies
• Sensor fusion
• Image/data fusion
• Machine vision
• Machine learning and deep learning
• Condition monitoring and predictive maintenance
• Non-destructive testing (NDT)
• Optics and photonics
• In-line inspection and instrumentation

Dr. Fang Cheng
Prof. Tegoeh Tjahjowidodo
Dr. Andrew Alexander Malcolm
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.