Design, Fabrication and Applications of Flexible/Wearable Electronics
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microelectronics".
Deadline for manuscript submissions: closed (15 May 2022) | Viewed by 17418
Special Issue Editor
Interests: flexible and wearable electronics; electronic skin; micro light-emitting diodes; compound semiconductor materials (III-V, III-N); microLED-based displays and biomedical applications
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With the upcoming Internet of Things (IoT) era, people want to receive and exchange more information using the state-of-the-art smart devices in their daily lives. Among the various electronic devices available, wearable smart devices have found themselves in the spotlight as a powerful infocommunication tool for new human–machine and human–human interface. Flexible/wearable electronics have been proposed as a key technology for bilateral communication in a hyperconnected society, due to their light weight, high accessibility, and excellent portability. With the extension of the wearable/flexible electronics field, several researchers have developed such technologies. However, various factors have to be taken into account for the enhancement of device performance in terms of device structure, materials, and fabrication processes. Enhanced wearable/flexible electronic devices can be utilized for various applications, such as health monitoring sensors, healthcare devices, displays, large-scale integrations (LSI), and so on. This Special Issue focuses on the design, materials, fabrication process, and applications for flexible and wearable electronic devices.
The topics of interest include but are not limited to:
- New device architecture;
- Materials for flexible/wearable electronics;
- MEMS/NEMS for flexible/wearable electronics;
- Novel technology for flexible/wearable electronics (e.g., nanoparticles, nanowires, and laser interaction);
- Flexible/wearable power electronics;
- Flexible/wearable optoelectronics;
- Device integration in flexible/wearable electronics;
- Bioapplications using flexible/wearable electronics (e.g., health monitoring sensors and healthcare devices).
Dr. Han Eol Lee
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- New device architecture
- Materials for flexible/wearable electronics
- MEMS/NEMS for flexible/wearable electronics
- Novel technology for flexible/wearable electronics (e.g., nanoparticles, nanowires, and laser interaction)
- Flexible/wearable power electronics
- Flexible/wearable optoelectronics
- Device integration in flexible/wearable electronics
- Bioapplications using flexible/wearable electronics
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.