Special Issue "Electromagnetic Interference and Compatibility"

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 31 March 2020.

Special Issue Editor

Prof. Dr. Paolo Stefano Crovetti
E-Mail Website1 Website2
Guest Editor
Department of Electronics and Telecommunications, Politecnico di Torino, 10129 Turin, Italy
Interests: electrical engineering, EMC, microelectronics, Internet of Things

Special Issue Information

Dear Colleagues,

Emerging Internet of Things (IoT), smart grid, and transport electrification applications, along with the advances of semiconductor technology, which enables faster switching devices for highly efficient power conversion, are bringing about new EMC challenges that need to be addressed through the whole design flow of electric and electronic systems, starting from the highest levels of abstraction down to the physical level.

The coexistence of ultra-low voltage IoT nodes and safety-critical sensors close to power converters and drives in smart grids and electric vehicles, in particular, are raising new EMC concerns which demand novel concepts and methodologies in EMC modeling, design, simulation, optimization, and measurement, both at the system- and at the integrated circuit-level. Moreover, a strong multidisciplinary approach is currently needed to gain insight into increasingly complex phenomena and interference scenarios.

On the other hand, emerging Artificial Intelligence (AI) and machine learning (ML) techniques provide new tools to EMC designers, whose potential is still to be explored.

In this Special Issue, contributions addressing electromagnetic compatibility and interference topics in the broadest sense, including but not limited to IC- and system-level immunity and susceptibility issues of either information and communication technology (ICT) and power electronic systems, either in emerging IoT, smart grid, electric vehicles applications or in more traditional systems, EMC-oriented simulation and measurement techniques, and EMC applications of ML and AI, are welcome and encouraged.

Prof. Dr. Paolo Stefano Crovetti
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • EMC in IoT applications
  • Power electronics EMC
  • IC-level EMC
  • System level EMC
  • Electromagnetic interference
  • Electromagnetic compatibility
  • EMC simulations
  • EMC measurements
  • EMI mitigation techniques
  • EMC applications of Artificial Intelligence/machine learning

Published Papers (3 papers)

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Research

Open AccessFeature PaperArticle
Hall-Effect Current Sensors Susceptibility to EMI: Experimental Study
Electronics 2019, 8(11), 1310; https://doi.org/10.3390/electronics8111310 - 08 Nov 2019
Abstract
The paper deals with the susceptibility to Electromagnetic Interference (EMI) of Hall-effect current sensors. They are usually employed in power systems because of their galvanic isolation. The EMI robustness of such contactless device was compared with that of resistive current sensing (wired method). [...] Read more.
The paper deals with the susceptibility to Electromagnetic Interference (EMI) of Hall-effect current sensors. They are usually employed in power systems because of their galvanic isolation. The EMI robustness of such contactless device was compared with that of resistive current sensing (wired method). To this purpose, a printed circuit board (PCB) was fabricated. EMI tests methods such as Bulk Current Injection (BCI), Transverse-Electromagnetic (TEM) cell and Direct Power injection (DPI) were performed to evaluate the robustness of the Hall-Effect current sensor. EMI-induced failures are highlighted by comparing the different measurements tests and setups. Full article
(This article belongs to the Special Issue Electromagnetic Interference and Compatibility)
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Open AccessArticle
A Novel Meander Split Power/Ground Plane Reducing Crosstalk of Traces Crossing Over
Electronics 2019, 8(9), 1041; https://doi.org/10.3390/electronics8091041 - 17 Sep 2019
Abstract
In this paper, a novel meander split power/ground plane is proposed for reducing crosstalk between parallel lines crossing over it. The working mechanism of the meander split scheme is investigated by simulations and measurements. The LC equivalent circuit and transmission line model are [...] Read more.
In this paper, a novel meander split power/ground plane is proposed for reducing crosstalk between parallel lines crossing over it. The working mechanism of the meander split scheme is investigated by simulations and measurements. The LC equivalent circuit and transmission line model are developed for modeling interactions between the meander split and the signal lines. The proposed meander structure enhances electromagnetic coupling between split planes. The capacitive coupling across the split ensures signal integrity and magnetic coupling between adjacent finger shaped structures suppresses lateral wave propagation along the split gap, which in turn helps suppress the crosstalk. The effectiveness of the meander split remains valid over very wide frequency ranges (up to 9 GHz). Experimental results show that the proposed structure improves the signal quality and reduces the near/far end crosstalk over 30 dB and 50% in the frequency domain and time domain, respectively. Full article
(This article belongs to the Special Issue Electromagnetic Interference and Compatibility)
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Open AccessArticle
A Dual-Perforation Electromagnetic Bandgap Structure for Parallel-Plate Noise Suppression in Thin and Low-Cost Printed Circuit Boards
Electronics 2019, 8(6), 719; https://doi.org/10.3390/electronics8060719 - 25 Jun 2019
Abstract
In this study, we propose and analyze a dual-perforation (DP) technique to improve an electromagnetic bandgap (EBG) structure in thin and low-cost printed circuit boards (PCBs). The proposed DP–EBG structure includes a power plane with a square aperture and a patch with an [...] Read more.
In this study, we propose and analyze a dual-perforation (DP) technique to improve an electromagnetic bandgap (EBG) structure in thin and low-cost printed circuit boards (PCBs). The proposed DP–EBG structure includes a power plane with a square aperture and a patch with an L-shape slot that overcomes efficiently the problems resulting from the low-inductance and the characteristic impedance of the EBG structure developed for parallel-plate noise suppression in thin PCBs. The effects of the proposed dual-perforation technique on the stopband characteristics and unit cell size are analyzed using an analytical dispersion method and full-wave simulations. The closed-form expressions for the main design parameters of the proposed DP–EBG structure are extracted as a design guide. It is verified based on full-wave simulations and measurements that the DP technique is a cost-effective method that can be used to achieve a size reduction and a stopband extension of the EBG structure in thin PCBs. For the same unit cell size and low cut-off frequency, the DP–EBG structure increases the stopband bandwidth by up to 473% compared to an inductance-enhanced EBG structure. In addition, the unit cell size is substantially reduced by up to 94.2% compared to the metallo–dielectric EBG structure. The proposed DP–EBG technique achieves the wideband suppression of parallel plate noise and miniaturization of the EBG structure in thin and low-cost PCBs. Full article
(This article belongs to the Special Issue Electromagnetic Interference and Compatibility)
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