Reprint
Electromagnetic Interference and Compatibility
Edited by
June 2021
206 pages
- ISBN978-3-0365-0500-8 (Hardback)
- ISBN978-3-0365-0501-5 (PDF)
This book is a reprint of the Special Issue Electromagnetic Interference and Compatibility that was published in
Computer Science & Mathematics
Engineering
Physical Sciences
Summary
Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.
Format
- Hardback
License
© 2022 by the authors; CC BY-NC-ND license
Keywords
electromagnetic bandgap (EBG); dual perforation (DP); parallel-plate noise; power delivery network (PDN); printed circuit board (PCB); meander split; power/ground plane; crosstalk; signal integrity; equivalent circuit; capacitive and magnetic coupling; hall-effect current sensors; commercial current sensor; electromagnetic compatibility (EMC); electromagnetic interference (EMI); direct power injection (DPI) test; transverse-electromagnetic (TEM) test; bulk current injection (BCI) test; Spread Spectrum; DC–DC power converters; digital communications; channel capacity; resonant coupling; Electromagnetic Interferences; Amplifiers; CMOS integrated circuits; susceptibility of the output pin; electromagnetic compatibility; power electronics EMC; EMI mitigation techniques; EMI filter design and optimization; common mode noise; EMI modeling; Fourier series; impedance balancing; resonant frequency; battery management system (BMS); Li-ion battery pack; electric vehicles (EVs); hybrid electric vehicles (HEVs); IC-level EMC; susceptibility to electromagnetic interference (EMI); direct power injection (DPI); anechoic chamber; electromagnetic compatibility; polyaniline; gelatin; composite; microwave absorption; dielectric permittivity; electrical conductivity; shielding effectiveness; biochar; eco-friendly material; cementitious composites; waveguides; electromagnetic interference (EMI) suppressors; sleeve ferrite cores; cable filtering; nanocrystalline (NC); split-core; snap ferrite; gap; DC currents; relative permeability; impedance; electromagnetic compatibility; conducted emissions; Discrete Wavelet Transform; electromagnetic interference; Empirical Mode Decomposition; harmonics; Switched-Mode Power Supplies; transients; Wavelet Packet Transform