Millimeter-Wave Integrated Circuits and Systems for 5G Applications

Dear Colleagues,

Due to the explosive growth of mobile devices and 5G connectivity, wireless transmission at a greater than one gigabit-per-second (Gbps) data rate is becoming essential. As a result, the network infrastructure will be endowed with an unprecedented degree of intelligence, integrating with the environment and offering fast, secure, and reliable communications. Objects like lamp posts, road signs, buildings, vehicles, drones, robots, trains, and watercrafts will be equipped with intelligent devices able to detect electromagnetic signals, perform computations, and store data.

It is extremely challenging to achieve Gbps data rate applications below a 6 GHz band due to spectrum scarcity. Therefore, the millimeter-wave (MMW) band has drawn increasing interest over recent years for enabling ultrahigh-speed wireless transmission. Combining cutting-edge network technology and MMW integrated circuit design, 5G technology offers connections that are multitudes faster than current connections with low latency (1 ms or less) and high speed (>1 Gbps) for massive Internet of Things (IoT), tactile internet, drones, and robotics. It will transform the way we live, play, work, and travel while delivering more performance, efficiency, and comfort. New products, systems, services, business models, and entire industries will be born as 5G technology provides a huge leap forward in speed, capacity, and connectivity. 

The main aim of this Special Issue is to disseminate latest findings, new research developments, and future trends and innovations in MMW integrated circuits and systems for 5G applications. Both theoretical and experimental studies for MMW IC design, architectures, technologies, devices, circuits, and systems are encouraged. Furthermore, high-quality review and survey papers are welcomed.

The papers considered for possible publication may focus on but not necessarily be limited to the following areas:

• MMW circuits, such as low noise amplifiers, mixers, voltage-controlled oscillators, power amplifiers, variable gain amplifiers, etc.;
• MMW architectures, systems and subsystems, such as receivers, transmitters, transceivers, phase-locked loops, frequency synthesizers, multistandard transceivers, digital radio, etc.;
• MMW passive structures such as transformers, hybrid couplers, filters, baluns, switches, antennae, etc.;
• MMW digital baseband; MMW data converters; wireless communication systems; wideband integrated circuits and systems; low-power and energy-efficient MMW digital systems;
• Advanced MMW IC; emerging MMW nanoscale CMOS IC; MMW 3D integrations; MMW SiP and SOC.

Prof. Dr. Yeo Kiat Seng
Guest Editor

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