Emerging Innovative Technologies in Millimeter and Terahertz Wave Wireless Communication Systems: Challenges and Solutions

Dear Colleagues,

Millimeter-wave (mmWave) and terahertz (THz) frequencies are key enablers of next-generation wireless communication, offering ultra-high data rates but facing challenges such as severe path loss and integration constraints. To address these, innovative solutions in intelligent reflecting surfaces (IRS), chip-scale interconnects, and advanced THz components are emerging.

IRS technology enables dynamic wave manipulation, improving coverage and energy efficiency and supporting integrated sensing and communication (ISAC). At the device level, on-chip antennas and novel transmission structures, such as topological photonic crystals and spoof surface plasmon polaritons (SPPs), provide low-loss interconnects crucial for THz chip integration. Additionally, new materials and fabrication techniques are advancing THz detectors, mixers, and RF front-end devices, enhancing sensitivity and efficiency.

This Special Issue highlights recent breakthroughs in these areas, addressing fundamental challenges and practical implementation strategies. By exploring IRS, chip-scale interconnects, and THz device innovations, we aim to foster interdisciplinary collaboration and drive the evolution of high-frequency telecommunication.

Dr. Lan Wang
Dr. Chao Tang
Guest Editors

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