Electronic Packaging Technologies and Applications

Dear Colleagues,

With the rapid development of wide bandgap semiconductors, 5G communication technology, etc., electronic packaging technology as a bridge connecting electronic devices and systems, especially for high-temperature, high-voltage, and high-frequency applications, has become increasingly important. From chip-scale to system-level packaging, from wire-bonding device to double-sided cooling module packaging, from soldering to low-temperature metal sintering, and from traditional two-dimensional packaging to advanced three-dimensional packaging, electronic packaging technology continues to promote the development of electronic products in the direction of miniaturization, high performance, high reliability, and low cost. In order to discuss in depth the latest progress, challenges, and opportunities of electronic packaging technology, as well as its application in various fields, we hereby invite high-quality manuscripts to be submitted to this Special Issue on “Electronic Packaging Technologies and Applications”.

This Special Issue aims to focus on the recent developments in advanced power electronics packaging technology and novel applications thereof. This includes (but is not limited to) advanced packaging technologies, packaging materials and processes, die attach and interconnection technologies, innovative packaging strategies, wide-bandgap device packaging, packaging design and modelling, system integration and optimization, thermal management, reliability assessment and lifetime prediction, application analysis, etc. Authors are invited to submit their latest research findings (including simulation and measurement results) for publication. Both regular articles and review papers are welcomed.

Dr. Meiyu Wang
Dr. Wanli Li
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.