Advances in Design, Packaging and Verification of Low-Power Integrated Circuits
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".
Deadline for manuscript submissions: 15 November 2025 | Viewed by 62
Special Issue Editors
Interests: low-power SoC; NoC; EDA
Interests: low-power IC design
Interests: advanced SoC design
Interests: mixed-signal analog IC design
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Rapid developments in artificial intelligence, embodied intelligence, edge computing, and cyber–physical systems give rise to different challenges involving complex design trade-offs. Several emerging applications demand energy-efficient solutions and higher levels of performance, reliability, and intelligence based on smart technology, while also demanding applications smaller in size and that use less power. The need to establish an appropriate balance between these contradictory requirements is driving the evolution of integrated circuits and systems. Therefore, the main objective of this Special Issue is to host emerging research and recent developments, reviews, and results in the field of the design, packaging, and verification of low-power integrated circuits. Relevant topics include, but are not limited to, the following:
- Design space exploration;
- System-on-a-chip design;
- Network-on-a-chip design;
- Domain-specific accelerator design;
- Software hardware co-design;
- Low-power memory design;
- Design and verification of multi-die integration;
- Chiplet interconnect design;
- Advanced packaging and system integration;
- Data converters—ADCs and DACs;
- Digital-based analog processing;
- Mixed-signal circuits/systems;
- Application of artificial intelligence in integrated circuits;
- Reliability design of integrated circuits;
- Reliability evaluation of digital integrated circuits.
Dr. Fangfa Fu
Prof. Dr. Liyi Xiao
Prof. Dr. Jinxiang Wang
Dr. Yongsheng Wang
Guest Editors
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- integrated circuits and systems
- mixed analog/digital circuit design
- memory design
- software hardware co-design
- EDA
- advanced packaging
- reliability
- artificial intelligence applications
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