Advances in Design, Packaging and Verification of Low-Power Integrated Circuits

Dear Colleagues,

Rapid developments in artificial intelligence, embodied intelligence, edge computing, and cyber–physical systems give rise to different challenges involving complex design trade-offs. Several emerging applications demand energy-efficient solutions and higher levels of performance, reliability, and intelligence based on smart technology, while also demanding applications smaller in size and that use less power. The need to establish an appropriate balance between these contradictory requirements is driving the evolution of integrated circuits and systems. Therefore, the main objective of this Special Issue is to host emerging research and recent developments, reviews, and results in the field of the design, packaging, and verification of low-power integrated circuits. Relevant topics include, but are not limited to, the following: 

• Design space exploration;
• System-on-a-chip design;
• Network-on-a-chip design;
• Domain-specific accelerator design;
• Software hardware co-design;
• Low-power memory design;
• Design and verification of multi-die integration;
• Chiplet interconnect design;
• Advanced packaging and system integration;
• Data converters—ADCs and DACs;
• Digital-based analog processing;
• Mixed-signal circuits/systems;
• Application of artificial intelligence in integrated circuits;
• Reliability design of integrated circuits;
• Reliability evaluation of digital integrated circuits.

Dr. Fangfa Fu
Prof. Dr. Liyi Xiao
Prof. Dr. Jinxiang Wang
Dr. Yongsheng Wang
Guest Editors

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