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Recent Advances in Intelligent Data Mining Methods, Systems, and Applications for the AI-Driven Era

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: 15 December 2026 | Viewed by 768

Editors


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Guest Editor
School of Computer Science, Nanjing University of Posts and Telecommunications, Nanjing 210023, China
Interests: reinforcement learning; data mining; AI4Science
Special Issues, Collections and Topics in MDPI journals
School of Computer Science, Nanjing University of Posts and Telecommunications, Nanjing 210023, China
Interests: data-centric artificial intelligence
School of Computer Science, Hohai University, Nanjing 210023, China
Interests: LLM; federated learning; edge AI

Special Issue Information

Dear Colleagues,

With the rapid growth of data volume and complexity across domains such as healthcare, transportation, finance, and energy systems, intelligent data mining has become a cornerstone of the digital and AI-driven era. This Special Issue aims to present the latest theoretical developments, algorithms, and system-level innovations that push the boundaries of intelligent data mining.

The scope of this collection includes, but is not limited to, deep learning-based data mining, reinforcement learning for adaptive decision-making, multi-source and multimodal data fusion, and optimization-driven knowledge discovery. We also welcome research on real-time and distributed data mining frameworks, edge/cloud intelligence, interpretable and responsible AI, and applications in smart cities, transportation, and energy systems.

This Special Issue seeks to bridge the gap between algorithmic innovation and practical deployment, highlighting new paradigms that integrate AI, optimization, and data analytics. By gathering interdisciplinary contributions, it will supplement existing literature by offering a holistic view of how intelligent data mining can enable autonomy, sustainability, and resilience in complex real-world systems.

We encourage submissions covering both foundational theories and engineering applications, including surveys, original research, and case studies.

Dr. Bolei Zhang
Dr. Yanchao Li
Dr. Mingtao Ji
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • intelligent data mining
  • deep learning
  • reinforcement learning
  • multi-source and multimodal data fusion
  • distributed and federated learning
  • optimization and big data analytics
  • edge and cloud intelligence
  • smart cities and transportation systems
  • AI4Science

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Published Papers (1 paper)

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Research

17 pages, 1745 KB  
Article
Cross-Scale Partial Order Metric Learning for Hierarchical Label Structures
by Zhihui Zhou, Haiyan Chen, Huiting Zhang and Ligang Yuan
Electronics 2026, 15(14), 2980; https://doi.org/10.3390/electronics15142980 - 8 Jul 2026
Viewed by 329
Abstract
Multi-scale label hierarchies with diverse semantic levels often give rise to similarity conflicts among sample pairs, posing a critical challenge to conventional deep metric learning (DML) methods. To address this issue, we propose Cross-Scale Partial Order Metric Learning (CSPOML), which is designed to [...] Read more.
Multi-scale label hierarchies with diverse semantic levels often give rise to similarity conflicts among sample pairs, posing a critical challenge to conventional deep metric learning (DML) methods. To address this issue, we propose Cross-Scale Partial Order Metric Learning (CSPOML), which is designed to enhance the hierarchical consistency of embeddings across different semantic levels. Specifically, we introduce a partial-order weight function to quantify the consistency of higher-level ancestor labels, and we design a cross-scale positive-pair consistency constraint together with a negative-pair trend-suppression mechanism to regulate similarity behavior across scales. Furthermore, we incorporate an uncertainty-aware proxy modeling strategy at the fine level to alleviate the noise introduced by ambiguous samples, thereby improving the structural alignment of the embedding space. Extensive experiments on three dynamic hierarchical metric learning datasets, DyML-Vehicle, DyML-Animal, and DyML-Product, show that CSPOML achieves consistent improvements on mAP and ASI while remaining competitive on Recall@1 across different semantic levels. These results support the effectiveness of the proposed cross-scale partial-order modeling. Full article
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