Advanced Materials for Thermal Management of Electronics

Dear Colleagues,

With advances in manufacturing technologies, it is now possible to produce electronics that are more compact and able to provide faster processing with increased computing capabilities. However, this increase in computing power has also increased the contemporary heat generation through such components. Therefore, it is now of the utmost important to come up with more advanced cooling systems for electronics. With current advances in materials sciences, we now have more advanced materials, such as nanomaterials and phase-change materials, etc., that can be used with optimized heat sinks to provide more effective thermal regulation for electronic components. There are, however, several challenges in commercializing these materials and mitigating their limiting factors, such as thermal conductivity in the case of phase-change materials and other problems with nanofluids. Therefore, this Special Issue will consider advances in such technologies, specifically focused on advanced-materials-based thermal management. Manuscripts for this Special Issue are welcome in the form of review articles, research papers, or short technical notes.

We invite recent experimental, numerical and theoretical developments in the field of advanced-materials-based thermal management of electronics. The research topics may include, but are not limited to, the following:

• Phase-change materials for electronics thermal management systems
• Porous media for thermal management
• Thermal management of photovoltaics
• Nanofluids-based thermal management systems
• Active and passive thermal management
• Utilization of nanotechnology for miniature heat sinks
• Micro-channels for thermal management
• Convection heat transfer for thermal management
• Efficiency improvement for thermal management
• Artificial intelligence-based models for optimization
• Numerical advances on thermal management systems

Dr. Hafiz Muhammad Ali
Dr. Hongwei Wu
Dr. Mehdi Khiadani
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.