Mixed Design of Integrated Circuits and Systems
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".
Deadline for manuscript submissions: 20 December 2024 | Viewed by 128
Special Issue Editor
Special Issue Information
Dear Colleagues,
This Special Issue is devoted to the mixed design aspects of integrated circuits and systems encompassing interdisciplinary research in design, modeling, simulation, testing, and manufacturing in various areas, such as micro- and nanoelectronics, semiconductors, sensors, actuators, biomedical applications, and power devices. The topics of this Special Issue include, but are not limited to, the following:
- Integrated Circuits and Microsystems
- Thermal Issues in Microelectronics
- Microelectronics Technology and Packaging
- Testing and Reliability
- Power Electronics
- Signal Processing
- Embedded Systems
- Medical Applications of Microsystems
Dr. Grzegorz Jablonski
Guest Editor
Manuscript Submission Information
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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- mixed design
- integrated circuits and systems
- embedded systems
- modeling
- signal processing
- technology
- packaging
- testing
- reliability
- medical applications
