Emerging Technologies and Applications in High-Performance Computing and Computer Architecture

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: 15 August 2025 | Viewed by 85

Special Issue Editor


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Guest Editor
INESC INOV, Instituto Superior de Engenharia de Lisboa, Instituto Politécnico de Lisboa, Lisboa, Portugal
Interests: computer architecture; digital system design; reconfigurable computing; embedded computing; deep learning; deep neural networks; signal processing
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Special Issue Information

Dear Colleagues,

High-performance computing (HPC) architectures are fundamental for the advance of topical fields such as artificial intelligence, big data analytics, and scientific research applied in the healthcare, industry, aerospace, and finance sectors, among others.

New architectures have been proposed to continuously increasing computing power, exploring several design dimensions, including the processing unit, the memory hierarchy, the interconnection structure, and the software. These aspects are interdependent, meaning that the evolution of HPC architectures can only proceed with the integrated advancements of all these components.

Innovation is taking place in many areas, some of them still in their infancy: quantum computing, neuromorphic computing, custom computing architectures tailored to specific applications, heterogeneous computing, photonic computing, green computing, embedded computing, memory innovations, and advanced interconnections and protocols.

This Special Issue aims to collect recent advances in high-performance computing and its applications, discussing potential topics such as, but not limited to, the following:

  • Computing architectures (parallel, distributed, edge-cloud);
  • Grid computing;
  • Edge computing;
  • High-performance embedded computing;
  • Applied HPC architectures (scientific simulations, big data analytics, deep learning, others);
  • Techniques for performance optimization;
  • Software for HPC (frameworks, tools, computing models);
  • Applications of HPC (fluid dynamics, molecular simulations, physics, engineering design, health, others);
  • Quantum computing;
  • Neuromorphic computing;
  • Custom accelerators (e.g., TPU, FPGA, GPU);
  • Memory architectures for HPC;
  • Interconnection architectures for parallel and distributed computing;
  • Other related topics.

Prof. Dr. Mário P. Véstias
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • high-performance computing
  • applied computing
  • custom computing

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Published Papers

This special issue is now open for submission.
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