Computational Design and Thermal Performance of Ceramic Materials

Dear Colleagues,

We are pleased to invite you to this Special Issue titled "Computational Design and Thermal Performance of Ceramic Materials."

Thermal properties are among the most important factors governing the performance and reliability of ceramic materials in applications such as aerospace, energy, electronics, and thermal protection. Advances in materials synthesis, characterization, and computational modeling have greatly improved our understanding of heat transport and thermal behavior in ceramics. Meanwhile, emerging materials, including high-entropy ceramics, ultra-high-temperature ceramics, ceramic composites, and nanostructured ceramics, have opened new opportunities for tailoring thermal performance.

This Special Issue aims to provide a comprehensive platform for publishing high-quality research on the thermal properties of ceramic materials, including both fundamental studies and practical applications. Contributions addressing thermal conductivity, thermal diffusivity, thermal expansion, heat capacity, thermal stability, thermal shock behavior, and heat transport mechanisms are particularly welcome. The Special Issue is fully aligned with the scope of Ceramics, covering the synthesis, processing, characterization, modeling, and application of ceramic materials. We encourage experimental, theoretical, and computational studies that advance our understanding of thermal phenomena in ceramics and contribute to the design of materials with enhanced thermal performance for applications.

In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:

• Thermal conductivity and thermal diffusivity of ceramic materials;
• Phonon transport and heat transfer mechanisms;
• Thermal expansion, thermal stress, and thermal shock resistance;
• Thermal barrier coatings (TBCs);
• High-entropy ceramics and compositionally complex ceramics;
• Ceramic matrix composites and porous ceramics;
• Defect engineering and microstructure effects on thermal properties；
• Advanced thermal characterization techniques;
• Thermal management materials.

We look forward to receiving your contributions.

Dr. Xuezhi Wang
Dr. Junwei Che
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the Special Issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Ceramics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.