Advanced Dielectric Ceramics and Devices

Dear Colleagues,

Advanced dielectric ceramics and their device integrations are at the forefront of modern electronics, power systems, and communication technologies. With ever-increasing demand for higher energy density, faster response, wider operating temperature ranges, and miniaturization, dielectric ceramics, ranging from linear dielectrics and ferroelectrics to relaxors and antiferroelectrics, offer unparalleled design flexibility through compositional tuning, defect engineering, and microstructural control. Yet, translating these laboratory advances into reliable, scalable devices requires concurrent breakthroughs in material synthesis, electrode engineering, interface physics, and device architecture.

This Special Issue, Advanced Dielectric Ceramics and Devices, will capture the latest innovations that bridge the gap between fundamental dielectric physics and practical device performance. We welcome contributions that address, but are not limited to, the following topics:

• Material Design and Discovery: High-permittivity and ultra-low-loss dielectrics, relaxor ferroelectrics, temperature-stable compositions, high-entropy dielectric ceramics, and textured or grain-oriented ceramics for anisotropic properties.
• Processing & Manufacturing: Sintering techniques (e.g., spark plasma sintering, microwave sintering), thin-film/thick-film deposition (e.g., sol–gel, sputtering, pulsed laser deposition), additive manufacturing of dielectric components, and interface engineering between dielectrics and electrodes.
• Device Applications: Multilayer ceramic capacitors (MLCCs), high-voltage pulse capacitors, microwave dielectric resonators and filters, tunable dielectric devices, energy-storage systems, electrocaloric cooling devices, piezoelectric sensors/actuators, and integrated passive components.
• Performance Characterization & Modeling: In situ/operando characterization (e.g., PFM, TEM, XRD under bias), high-frequency and high-temperature dielectric spectroscopy, breakdown strength and reliability testing, phase-field simulations, and machine learning-assisted property prediction.
• Sustainability & Scalability: Lead-free dielectric compositions, recyclable or low-cost raw materials, eco-friendly processing routes, and lifecycle assessment of dielectric devices for green electronics.

We particularly encourage interdisciplinary studies that combine advanced computational design, precise synthesis, sophisticated characterization, and device-level validation under realistic operating conditions (e.g., high voltage, elevated temperature, or harsh environments). Papers addressing industrial-scale manufacturability, cost-effectiveness, and long-term reliability will be given high priority.

By assembling state-of-the-art research from around the globe, this Special Issue aspires to chart a clear roadmap for the future of dielectric ceramics and device engineering, fostering collaborations among materials scientists, electrical engineers, physicists, and industry partners. We invite original research articles, comprehensive reviews, and forward-looking perspectives that push the boundaries of dielectric performance and device functionality.

We look forward to receiving your contributions and to advancing this vital field together.

Dr. Tianyu Li
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the Special Issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Ceramics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.