2026 September - 4 articles
The increasing bandwidth demand of artificial-intelligence computing and data-center interconnects has driven silicon photonic optical engines toward higher capacity, compact packaging, and improved scalability. This work presents the packaging desig...
Optical through silicon vias (OTSVs) have been regarded as a promising alternative to conventional (electrical) through silicon vias (TSVs) for the next-generation electro-optic heterogeneous integration. This study systematically examines the influe...
Electromagnetic interference (EMI) has become a serious challenge for signal integrity (SI) in modern high-speed digital systems. With the technology scaling down into nanometric CMOS technologies and lowering supply voltage, EMI induced signal integ...
As dynamic random-access memory (DRAM) continues to scale down and achieve higher integration density, the cell layout has transitioned to 6F2, resulting in narrower spacing between adjacent word lines (WLs). Consequently, cell-to-cell disturbance ha...
