About Microelectronics

Aims

Microelectronics (ISSN 3042-5344) publishes regular research papers, reviews, technical notes and communications that cover all aspects of microelectronics science, from fundamentals and physics, materials and fabrication technology, device design, circuit design and system integration to its application and emerging technologies and testing and reliability.

Microelectronics is dedicated to facilitating the dissemination of scientific research in microelectronics by encouraging authors to publish their experimental and theoretical findings with thoroughness and detail. There is no restriction on the maximum length of the papers. We also encourage authors to share the full details of their calculations and experimental methodologies within their contributions. Our goal is to foster a transparent and accessible platform that supports advancements in microelectronic research and technology.

Scope

  1. Device Design and Engineering
    • Transistor technologies (ultra-scaled, thin-film, organic, ferroelectric);
    • MEMS/NEMS, power devices, RF/microwave components;
    • Neuromorphic computing devices;
    • Resistive, capacitive, and charge-based memories (RRAM, PCRAM, FeRAM, MRAM);
    • Flexible, wearable, and bioelectronic devices;
    • Heterogeneous integration and chiplet-based systems. 
  2. Circuit Design and System Integration
    • Analog/digital/mixed-signal IC design;
    • System-on-Chip (SoC) and embedded systems for IoT;
    • Electronic Design Automation (EDA): Tools for simulation, verification, and optimization;
    • AI-driven circuit architectures and neuromorphic computing circuits;
    • High-speed interfaces and 5G-enabled systems. 
  3. Applications and Emerging Technologies
    • Sustainable microelectronics manufacturing: Energy-efficient processes, recyclable materials;
    • Biomedical sensors, automotive electronics, and AI-integrated systems;
    • Quantum computing interfaces and quantum-classical hybrid systems;
    • 5G/6G wireless communications and edge computing;
    • Energy harvesting solutions (photovoltaic, piezoelectric). 
  4. Materials and Fabrication Innovations
    • Wide-bandgap semiconductors, 2D materials (graphene, TMDCs), and nanomaterials;
    • Advanced lithography (EUV, nanoimprint) and 3D integration techniques;
    • Low-/high-κ dielectrics, flexible substrates, and biocompatible materials. 
  5. Testing, Reliability, and Standards
    • Fault diagnosis, reliability modeling, and lifetime prediction;
    • Nanoscale metrology (TEM, AFM) and industry compliance frameworks.

MDPI Publication Ethics Statement

Committee on Publication Ethics MDPI is a member of the Committee on Publication Ethics (COPE). MDPI takes the responsibility to enforce a rigorous peer-review together with strict ethical policies and standards to ensure to add high quality scientific works to the field of scholarly publication. Unfortunately, cases of plagiarism, data falsification, inappropriate authorship credit, and the like, do arise. MDPI takes such publishing ethics issues very seriously and our editors are trained to proceed in such cases with a zero tolerance policy. To verify the originality of content submitted to our journals, we use iThenticate to check submissions against previous publications.

Book Reviews

Authors and publishers are encouraged to send review copies of their recent related books to the following address. Received books will be listed as Books Received within the journal's News & Announcements section.

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Copyright / Open Access

Articles published in Microelectronics will be Open-Access articles distributed under the terms and conditions of the Creative Commons Attribution License (CC BY). The copyright is retained by the author(s). MDPI will insert the following note at the end of the published text:

© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).

Reprints

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Announcement and Advertisement

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