You seem to have javascript disabled. Please note that many of the page functionalities won't work as expected without javascript enabled.

Search for Articles:

Title / Keyword

Author / Affiliation / Email

Journal

Article Type

Advanced Search

Section

Special Issue

Volume

Issue

Number

Page

Logical OperatorOperator

Search Text

Search Type

Submit to Microelectronics Review for Microelectronics

Journal Menu

Journal Browser

► Journal Browser

Most Cited & Viewed

Most Cited & Viewed Papers

Most Cited Papers
Most Viewed Papers
Most Downloaded Papers

Citations	Article
7	Quantum Biosensors on Chip: A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits by Yasaman Torabi, Shahram Shirani and James P. Reilly
2	Development and Optimization of Fine-Pitch RDL for RDL Interposer and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology by Jung Won Lee, Sung Hyuk Lee, Jay Kim, Lewis Kang, Han Ju Yu, Min Ji Lee, Seong Hwan Han, Jae Kyung Lee, Hailey Hwang, Jung Gi Kim, Chan Young Hong, Jade Park, Su Hyun Kim, Myeung Jin Kim and Moon Jung Kim
1	Back-Gate Bias Effects on Breakdown Voltage in Lateral Silicon-on-Insulator Power Devices by Viswanathan Naveen Kumar, Mohammed Tanvir Quddus, Zeinab Ramezani, Mihir Mudholkar and Prasad Venkatraman
1	Compact and Efficient First-Order All-Pass Filter in Voltage Mode by Khushbu Bansal, Bhartendu Chaturvedi and Jitendra Mohan
1	Air Gaps Fabrication for Sub-100 nm GaN HEMTs by Novel SF₆ Plasma Etching by Simon St-Jacques, Mariyam Salmi, Oleh Fesiienko, Erwine Pargon, Ali Soltani, Bassem Salem and Hassan Maher
1	Adversarial Attack Resilient ML-Assisted Golden Free Approach for Hardware Trojan Detection by Ashutosh Ghimire, Mohammed Alkurdi, Ghazal Ghajari, Mohammad Arif Hossain and Fathi Amsaad
1	FEM Study on Electrolyte Additive, External Current Density, and via Geometry for Cu Electroplating of Through-Glass Vias by Xuan Zhang, Yuqi Lin, Rong Wang, Xingyan Zhao, Yang Qiu, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu
1	Bridging Architectures, Mapping, and Learning for DNN Acceleration with Processing-in-Memory and In-Memory Computing Systems by Syeda Munazza Marium and Song Chen

Citations	Article
1	FEM Study on Electrolyte Additive, External Current Density, and via Geometry for Cu Electroplating of Through-Glass Vias by Xuan Zhang, Yuqi Lin, Rong Wang, Xingyan Zhao, Yang Qiu, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu
1	Bridging Architectures, Mapping, and Learning for DNN Acceleration with Processing-in-Memory and In-Memory Computing Systems by Syeda Munazza Marium and Song Chen

Citations	Article
7	Quantum Biosensors on Chip: A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits by Yasaman Torabi, Shahram Shirani and James P. Reilly
6	A Survey of Machine and Deep Learning Techniques in Analog Integrated Circuit Layout Synthesis by Ricardo M. F. Martins
2	Development and Optimization of Fine-Pitch RDL for RDL Interposer and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology by Jung Won Lee, Sung Hyuk Lee, Jay Kim, Lewis Kang, Han Ju Yu, Min Ji Lee, Seong Hwan Han, Jae Kyung Lee, Hailey Hwang, Jung Gi Kim, Chan Young Hong, Jade Park, Su Hyun Kim, Myeung Jin Kim and Moon Jung Kim
1	Back-Gate Bias Effects on Breakdown Voltage in Lateral Silicon-on-Insulator Power Devices by Viswanathan Naveen Kumar, Mohammed Tanvir Quddus, Zeinab Ramezani, Mihir Mudholkar and Prasad Venkatraman
1	Compact and Efficient First-Order All-Pass Filter in Voltage Mode by Khushbu Bansal, Bhartendu Chaturvedi and Jitendra Mohan
1	Air Gaps Fabrication for Sub-100 nm GaN HEMTs by Novel SF₆ Plasma Etching by Simon St-Jacques, Mariyam Salmi, Oleh Fesiienko, Erwine Pargon, Ali Soltani, Bassem Salem and Hassan Maher
1	Adversarial Attack Resilient ML-Assisted Golden Free Approach for Hardware Trojan Detection by Ashutosh Ghimire, Mohammed Alkurdi, Ghazal Ghajari, Mohammad Arif Hossain and Fathi Amsaad
1	FEM Study on Electrolyte Additive, External Current Density, and via Geometry for Cu Electroplating of Through-Glass Vias by Xuan Zhang, Yuqi Lin, Rong Wang, Xingyan Zhao, Yang Qiu, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu
1	Bridging Architectures, Mapping, and Learning for DNN Acceleration with Processing-in-Memory and In-Memory Computing Systems by Syeda Munazza Marium and Song Chen

More Articles...

Views	Article
5400	Quantum Biosensors on Chip: A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits by Yasaman Torabi, Shahram Shirani and James P. Reilly
5235	A Survey of Machine and Deep Learning Techniques in Analog Integrated Circuit Layout Synthesis by Ricardo M. F. Martins
4301	Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies by M. Jamal Deen
3004	Development and Optimization of Fine-Pitch RDL for RDL Interposer and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology by Jung Won Lee, Sung Hyuk Lee, Jay Kim, Lewis Kang, Han Ju Yu, Min Ji Lee, Seong Hwan Han, Jae Kyung Lee, Hailey Hwang, Jung Gi Kim, Chan Young Hong, Jade Park, Su Hyun Kim, Myeung Jin Kim and Moon Jung Kim
2280	Compact and Efficient First-Order All-Pass Filter in Voltage Mode by Khushbu Bansal, Bhartendu Chaturvedi and Jitendra Mohan
1897	Electromechanical and Acoustic Characterization of Dual-Mode Rectangular PMUT by Yumna Birjis and Arezoo Emadi
1779	Scaling the Area of Synthesizable FPGA Tiles Across Semiconductor Process Nodes by Mousa Al-Qawasmi and Andy Ye
1607	Back-Gate Bias Effects on Breakdown Voltage in Lateral Silicon-on-Insulator Power Devices by Viswanathan Naveen Kumar, Mohammed Tanvir Quddus, Zeinab Ramezani, Mihir Mudholkar and Prasad Venkatraman
1536	Adversarial Attack Resilient ML-Assisted Golden Free Approach for Hardware Trojan Detection by Ashutosh Ghimire, Mohammed Alkurdi, Ghazal Ghajari, Mohammad Arif Hossain and Fathi Amsaad
1431	Air Gaps Fabrication for Sub-100 nm GaN HEMTs by Novel SF₆ Plasma Etching by Simon St-Jacques, Mariyam Salmi, Oleh Fesiienko, Erwine Pargon, Ali Soltani, Bassem Salem and Hassan Maher

Views	Article
5400	Quantum Biosensors on Chip: A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits by Yasaman Torabi, Shahram Shirani and James P. Reilly
3004	Development and Optimization of Fine-Pitch RDL for RDL Interposer and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology by Jung Won Lee, Sung Hyuk Lee, Jay Kim, Lewis Kang, Han Ju Yu, Min Ji Lee, Seong Hwan Han, Jae Kyung Lee, Hailey Hwang, Jung Gi Kim, Chan Young Hong, Jade Park, Su Hyun Kim, Myeung Jin Kim and Moon Jung Kim
2280	Compact and Efficient First-Order All-Pass Filter in Voltage Mode by Khushbu Bansal, Bhartendu Chaturvedi and Jitendra Mohan
1897	Electromechanical and Acoustic Characterization of Dual-Mode Rectangular PMUT by Yumna Birjis and Arezoo Emadi
1779	Scaling the Area of Synthesizable FPGA Tiles Across Semiconductor Process Nodes by Mousa Al-Qawasmi and Andy Ye
1607	Back-Gate Bias Effects on Breakdown Voltage in Lateral Silicon-on-Insulator Power Devices by Viswanathan Naveen Kumar, Mohammed Tanvir Quddus, Zeinab Ramezani, Mihir Mudholkar and Prasad Venkatraman
1536	Adversarial Attack Resilient ML-Assisted Golden Free Approach for Hardware Trojan Detection by Ashutosh Ghimire, Mohammed Alkurdi, Ghazal Ghajari, Mohammad Arif Hossain and Fathi Amsaad
1431	Air Gaps Fabrication for Sub-100 nm GaN HEMTs by Novel SF₆ Plasma Etching by Simon St-Jacques, Mariyam Salmi, Oleh Fesiienko, Erwine Pargon, Ali Soltani, Bassem Salem and Hassan Maher
1382	Simulation of the Effects of the Pillar Configurations on 1.2 kV 4H-SiC Superjunction DMOSFET by Keng-Ming Liu and Shih-Ching Ou
1366	A Systematic Modeling Methodology for RF Capacitors and Inductors by Ria Aprilliyani, Yeonggeon Lee and Dae-Woong Park

Views	Article
1897	Electromechanical and Acoustic Characterization of Dual-Mode Rectangular PMUT by Yumna Birjis and Arezoo Emadi
1366	A Systematic Modeling Methodology for RF Capacitors and Inductors by Ria Aprilliyani, Yeonggeon Lee and Dae-Woong Park
1345	Bridging Architectures, Mapping, and Learning for DNN Acceleration with Processing-in-Memory and In-Memory Computing Systems by Syeda Munazza Marium and Song Chen
1031	How Can the Carrier Mobility in Planar Si-Based MOSFETs Be Enhanced? by Smahane Dahbi, Romain M. R. Kubica, Pascal Masson, Julien Dura, Franck Julien and Magali Gregoire
1004	FEM Study on Electrolyte Additive, External Current Density, and via Geometry for Cu Electroplating of Through-Glass Vias by Xuan Zhang, Yuqi Lin, Rong Wang, Xingyan Zhao, Yang Qiu, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu
980	A Comprehensive Design Flow of D-Band Analog Receiver Blocks for 5G Backhauling in SiGe BiCMOS Technology by Hassan Sadeghichameh, Guglielmo De Filippi, Lorenzo Piotto, Andrea Mazzanti, Pasquale Tommasino and Alessandro Trifiletti
705	A 1 V, 10 μW FLL-Based Time-Domain CMOS Temperature Sensor with +1.2 °C/−0.9 °C Inaccuracy from −40 °C to 125 °C by Huabo Sun, Yuheng Zhang, Luhan Yang, Jing Li and Huiling Zhao
685	Mitigation of the Row-Hammer Effect in Sub-20 nm Dynamic Random-Access Memory (DRAM) Using Low-k Dielectrics by Jeongbeen Park, Dongseok Oh, Jae Yeon Park, Dongjun Jang and Sangwan Kim
379	EMI-Induced Eye Diagram Degradation in CMOS Inverter: Experimental Analysis and Predictive Modeling by Mohammad Abedi, Zahra Abedi, Sameer Hemmady, Edl Schamiloglu and Payman Zarkesh-Ha
304	Study of Transmission Performance of Optical Through Silicon via: From a Fabrication Imperfection Perspective by Boyang Hu, Siwei Xie, Fangcheng Cao, Xingyan Zhao, Yang Qiu, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu

Views	Article
5400	Quantum Biosensors on Chip: A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits by Yasaman Torabi, Shahram Shirani and James P. Reilly
5235	A Survey of Machine and Deep Learning Techniques in Analog Integrated Circuit Layout Synthesis by Ricardo M. F. Martins
4301	Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies by M. Jamal Deen
3004	Development and Optimization of Fine-Pitch RDL for RDL Interposer and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology by Jung Won Lee, Sung Hyuk Lee, Jay Kim, Lewis Kang, Han Ju Yu, Min Ji Lee, Seong Hwan Han, Jae Kyung Lee, Hailey Hwang, Jung Gi Kim, Chan Young Hong, Jade Park, Su Hyun Kim, Myeung Jin Kim and Moon Jung Kim
2280	Compact and Efficient First-Order All-Pass Filter in Voltage Mode by Khushbu Bansal, Bhartendu Chaturvedi and Jitendra Mohan
1897	Electromechanical and Acoustic Characterization of Dual-Mode Rectangular PMUT by Yumna Birjis and Arezoo Emadi
1779	Scaling the Area of Synthesizable FPGA Tiles Across Semiconductor Process Nodes by Mousa Al-Qawasmi and Andy Ye
1607	Back-Gate Bias Effects on Breakdown Voltage in Lateral Silicon-on-Insulator Power Devices by Viswanathan Naveen Kumar, Mohammed Tanvir Quddus, Zeinab Ramezani, Mihir Mudholkar and Prasad Venkatraman
1536	Adversarial Attack Resilient ML-Assisted Golden Free Approach for Hardware Trojan Detection by Ashutosh Ghimire, Mohammed Alkurdi, Ghazal Ghajari, Mohammad Arif Hossain and Fathi Amsaad
1431	Air Gaps Fabrication for Sub-100 nm GaN HEMTs by Novel SF₆ Plasma Etching by Simon St-Jacques, Mariyam Salmi, Oleh Fesiienko, Erwine Pargon, Ali Soltani, Bassem Salem and Hassan Maher

More Articles...

Downloads	Article
1020	Quantum Biosensors on Chip: A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits by Yasaman Torabi, Shahram Shirani and James P. Reilly
753	A Survey of Machine and Deep Learning Techniques in Analog Integrated Circuit Layout Synthesis by Ricardo M. F. Martins
663	Development and Optimization of Fine-Pitch RDL for RDL Interposer and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology by Jung Won Lee, Sung Hyuk Lee, Jay Kim, Lewis Kang, Han Ju Yu, Min Ji Lee, Seong Hwan Han, Jae Kyung Lee, Hailey Hwang, Jung Gi Kim, Chan Young Hong, Jade Park, Su Hyun Kim, Myeung Jin Kim and Moon Jung Kim
621	Compact and Efficient First-Order All-Pass Filter in Voltage Mode by Khushbu Bansal, Bhartendu Chaturvedi and Jitendra Mohan
547	Scaling the Area of Synthesizable FPGA Tiles Across Semiconductor Process Nodes by Mousa Al-Qawasmi and Andy Ye
542	Back-Gate Bias Effects on Breakdown Voltage in Lateral Silicon-on-Insulator Power Devices by Viswanathan Naveen Kumar, Mohammed Tanvir Quddus, Zeinab Ramezani, Mihir Mudholkar and Prasad Venkatraman
500	Air Gaps Fabrication for Sub-100 nm GaN HEMTs by Novel SF₆ Plasma Etching by Simon St-Jacques, Mariyam Salmi, Oleh Fesiienko, Erwine Pargon, Ali Soltani, Bassem Salem and Hassan Maher
488	Simulation of the Effects of the Pillar Configurations on 1.2 kV 4H-SiC Superjunction DMOSFET by Keng-Ming Liu and Shih-Ching Ou
457	Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies by M. Jamal Deen
363	A Systematic Modeling Methodology for RF Capacitors and Inductors by Ria Aprilliyani, Yeonggeon Lee and Dae-Woong Park

Downloads	Article
1020	Quantum Biosensors on Chip: A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits by Yasaman Torabi, Shahram Shirani and James P. Reilly
663	Development and Optimization of Fine-Pitch RDL for RDL Interposer and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology by Jung Won Lee, Sung Hyuk Lee, Jay Kim, Lewis Kang, Han Ju Yu, Min Ji Lee, Seong Hwan Han, Jae Kyung Lee, Hailey Hwang, Jung Gi Kim, Chan Young Hong, Jade Park, Su Hyun Kim, Myeung Jin Kim and Moon Jung Kim
621	Compact and Efficient First-Order All-Pass Filter in Voltage Mode by Khushbu Bansal, Bhartendu Chaturvedi and Jitendra Mohan
547	Scaling the Area of Synthesizable FPGA Tiles Across Semiconductor Process Nodes by Mousa Al-Qawasmi and Andy Ye
542	Back-Gate Bias Effects on Breakdown Voltage in Lateral Silicon-on-Insulator Power Devices by Viswanathan Naveen Kumar, Mohammed Tanvir Quddus, Zeinab Ramezani, Mihir Mudholkar and Prasad Venkatraman
500	Air Gaps Fabrication for Sub-100 nm GaN HEMTs by Novel SF₆ Plasma Etching by Simon St-Jacques, Mariyam Salmi, Oleh Fesiienko, Erwine Pargon, Ali Soltani, Bassem Salem and Hassan Maher
488	Simulation of the Effects of the Pillar Configurations on 1.2 kV 4H-SiC Superjunction DMOSFET by Keng-Ming Liu and Shih-Ching Ou
363	A Systematic Modeling Methodology for RF Capacitors and Inductors by Ria Aprilliyani, Yeonggeon Lee and Dae-Woong Park
343	Adversarial Attack Resilient ML-Assisted Golden Free Approach for Hardware Trojan Detection by Ashutosh Ghimire, Mohammed Alkurdi, Ghazal Ghajari, Mohammad Arif Hossain and Fathi Amsaad
304	Electromechanical and Acoustic Characterization of Dual-Mode Rectangular PMUT by Yumna Birjis and Arezoo Emadi

Downloads	Article
363	A Systematic Modeling Methodology for RF Capacitors and Inductors by Ria Aprilliyani, Yeonggeon Lee and Dae-Woong Park
304	Electromechanical and Acoustic Characterization of Dual-Mode Rectangular PMUT by Yumna Birjis and Arezoo Emadi
290	A Comprehensive Design Flow of D-Band Analog Receiver Blocks for 5G Backhauling in SiGe BiCMOS Technology by Hassan Sadeghichameh, Guglielmo De Filippi, Lorenzo Piotto, Andrea Mazzanti, Pasquale Tommasino and Alessandro Trifiletti
259	FEM Study on Electrolyte Additive, External Current Density, and via Geometry for Cu Electroplating of Through-Glass Vias by Xuan Zhang, Yuqi Lin, Rong Wang, Xingyan Zhao, Yang Qiu, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu
244	How Can the Carrier Mobility in Planar Si-Based MOSFETs Be Enhanced? by Smahane Dahbi, Romain M. R. Kubica, Pascal Masson, Julien Dura, Franck Julien and Magali Gregoire
241	A 1 V, 10 μW FLL-Based Time-Domain CMOS Temperature Sensor with +1.2 °C/−0.9 °C Inaccuracy from −40 °C to 125 °C by Huabo Sun, Yuheng Zhang, Luhan Yang, Jing Li and Huiling Zhao
192	Bridging Architectures, Mapping, and Learning for DNN Acceleration with Processing-in-Memory and In-Memory Computing Systems by Syeda Munazza Marium and Song Chen
180	Mitigation of the Row-Hammer Effect in Sub-20 nm Dynamic Random-Access Memory (DRAM) Using Low-k Dielectrics by Jeongbeen Park, Dongseok Oh, Jae Yeon Park, Dongjun Jang and Sangwan Kim
132	EMI-Induced Eye Diagram Degradation in CMOS Inverter: Experimental Analysis and Predictive Modeling by Mohammad Abedi, Zahra Abedi, Sameer Hemmady, Edl Schamiloglu and Payman Zarkesh-Ha
110	Study of Transmission Performance of Optical Through Silicon via: From a Fabrication Imperfection Perspective by Boyang Hu, Siwei Xie, Fangcheng Cao, Xingyan Zhao, Yang Qiu, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu

Downloads	Article
1020	Quantum Biosensors on Chip: A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits by Yasaman Torabi, Shahram Shirani and James P. Reilly
753	A Survey of Machine and Deep Learning Techniques in Analog Integrated Circuit Layout Synthesis by Ricardo M. F. Martins
663	Development and Optimization of Fine-Pitch RDL for RDL Interposer and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology by Jung Won Lee, Sung Hyuk Lee, Jay Kim, Lewis Kang, Han Ju Yu, Min Ji Lee, Seong Hwan Han, Jae Kyung Lee, Hailey Hwang, Jung Gi Kim, Chan Young Hong, Jade Park, Su Hyun Kim, Myeung Jin Kim and Moon Jung Kim
621	Compact and Efficient First-Order All-Pass Filter in Voltage Mode by Khushbu Bansal, Bhartendu Chaturvedi and Jitendra Mohan
547	Scaling the Area of Synthesizable FPGA Tiles Across Semiconductor Process Nodes by Mousa Al-Qawasmi and Andy Ye
542	Back-Gate Bias Effects on Breakdown Voltage in Lateral Silicon-on-Insulator Power Devices by Viswanathan Naveen Kumar, Mohammed Tanvir Quddus, Zeinab Ramezani, Mihir Mudholkar and Prasad Venkatraman
500	Air Gaps Fabrication for Sub-100 nm GaN HEMTs by Novel SF₆ Plasma Etching by Simon St-Jacques, Mariyam Salmi, Oleh Fesiienko, Erwine Pargon, Ali Soltani, Bassem Salem and Hassan Maher
488	Simulation of the Effects of the Pillar Configurations on 1.2 kV 4H-SiC Superjunction DMOSFET by Keng-Ming Liu and Shih-Ching Ou
457	Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies by M. Jamal Deen
363	A Systematic Modeling Methodology for RF Capacitors and Inductors by Ria Aprilliyani, Yeonggeon Lee and Dae-Woong Park

Back to TopTop