- Article
Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
- Dong Yang,
- Xumeng Zhang and
- Jianguo Zhu
Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film...

