Silicon Based Nanostructures for Nanoelectronics

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanoelectronics, Nanosensors and Devices".

Deadline for manuscript submissions: closed (20 August 2021) | Viewed by 2234

Special Issue Editors


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Guest Editor
Institute of Microelectronics of Barcelona (IMB-CNM, CSIC), Campus de la UAB, 08193 Bellaterra, Catalonia, Spain
Interests: nanofabrication and characterization of novel suspended silicon structures for nanoelectronics (NEMS, FETs and SETs) for biosensing applications. Light trapping architectures for enhanced solar absorption based on nanostructures
School of Electrical and Computer Engineering, Ben-Gurion University of the Negev, Beer-Sheva 8410501, Israel
Interests: biological sensing based on multi-gate silicon field-effect transistors and electrochemical impedance spectroscopy; field-effect transistors based on the electrostatically-formed nanowire; light trapping based on arrays of nanostructures; photovoltaics; photocarrier collection; omnidirectional broadband absorption of solar radiation
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Guest Editor
International Iberian Nanotechnology Laboratory, Braga, Portugal
Interests: Development of nanofabrication processes for the realization of nanosensors and transducers for various applications, including nanophotonics, nanoelectromechanical systems, nanofluidics and acoustics.

Special Issue Information

Dear Colleagues,

The era extending since the late 20th century to our times has been termed the Silicon age due to the enormous contribution of microelectronics-based silicon to world economy and to our way of life. More recently, the advent of nanotechnology introduced electronics based on nanostructures, or nanoelectronics, defined as structures in which quantum mechanical effects needs to be accounted for, and more generally defined as structures with at least two dimensions that are in the range of several hundreds of nanometers. The advancement of silicon-based electronics into nanoelectronics is normally considered a disruptive technology that departs from traditional silicon devices in terms of fabrication, application, and performance among others.

Specifically, this Special Issue focuses on recent advancements in silicon nanoelectronics in terms of fabrication methods, electronic device designs (nanocircuitry), applications (optoelectronics, nanosensors, NEMS, quantum computers, energy production, medical diagnostics, etc.), hybrid electronic devices, etc.

This Special Issue is opened to original research articles, as well as review papers, that potentially help researchers worldwide to understand the latest trend and progress in the silicon nanoelectronics research field.

Dr. Jordi Llobet
Dr. Gil Shalev
Dr. Carlos Calaza
Guest Editors

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2900 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Field-effect and single electron transistors
  • Photovoltaic cells
  • Energy harvesting and storage
  • Memory devices
  • Optoelectronic devices (Photonic crystals, Quantum dots, Metamaterials…)
  • Hybrid devices
  • Fabrication methods: bottom-up, top-down
  • Sensors: Bio-chemical sensors, field-effect sensors, radiation sensors, etc.
  • Junctions: homojunctions, heterojunctions, hybrid junctions
  • Photocarrier collection
  • Silicon nanowires
  • MEMS and NEMS
  • Quantum computers

Published Papers (1 paper)

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Research

12 pages, 4011 KiB  
Article
Optimization of Sacrificial Layer Etching in Single-Crystal Silicon Nano-Films Transfer Printing for Heterogeneous Integration Application
by Jiaqi Zhang, Yichang Wu, Guofang Yang, Dazheng Chen, Jincheng Zhang, Hailong You, Chunfu Zhang and Yue Hao
Nanomaterials 2021, 11(11), 3085; https://doi.org/10.3390/nano11113085 - 16 Nov 2021
Cited by 1 | Viewed by 1680
Abstract
As one of the important technologies in the field of heterogeneous integration, transfer technology has broad application prospects and unique technical advantages. This transfer technology includes the wet chemical etching of a sacrificial layer, such that silicon nano-film devices are released from the [...] Read more.
As one of the important technologies in the field of heterogeneous integration, transfer technology has broad application prospects and unique technical advantages. This transfer technology includes the wet chemical etching of a sacrificial layer, such that silicon nano-film devices are released from the donor substrate and can be transferred. However, in the process of wet etching the SiO2 sacrificial layer present underneath the single-crystal silicon nano-film by using the transfer technology, the etching is often incomplete, which seriously affects the efficiency and quality of the transfer and makes the device preparation impossible. This article analyzes the principle of incomplete etching, and compares the four factors that affect the etching process, including the size of Si nano-film on top of the sacrificial layer, the location of the anchor point, the shape of Si nano-film on top of the sacrificial layer, and the thickness of the sacrificial layer. Finally, the etching conditions are obtained to avoid the phenomenon of incomplete etching of the sacrificial layer, so that the transfer technology can be better applied in the field of heterogeneous integration. Additionally, Si MOSFETs (Metal-Oxide-Semiconductor Field Effect Transistors) on sapphire substrate were fabricated by using the optimized transfer technology. Full article
(This article belongs to the Special Issue Silicon Based Nanostructures for Nanoelectronics)
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