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Molecules
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Epoxy Resin Synthesis, Performance and Application Research: Second Edition
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Epoxy Resin Synthesis, Performance and Application Research: Second Edition

A special issue of Molecules (ISSN 1420-3049). This special issue belongs to the section "Macromolecular Chemistry".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 343

Special Issue Editor

Dr. Jin Li

E-Mail Website
Guest Editor
School of Electrical and Information Engineering, Tianjin University, Tianjin 300072, China
Interests: functional graded materials; surface modification; quantum chemical calculation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Epoxy resin has been applied in aerospace, automotive, energy, adhesives, electronics, coatings, etc., thanks to its versatile properties. Recently, there has been an ever-increasing demand for advanced epoxy resin systems with well-defined structures and desirable properties for adaptation to the newer requirements of different industries. The properties of epoxy end-use products are closely associated with the structure of the growing network. It is important to obtain a complete mechanism and accurate kinetic model with predictive capabilities. Suitable modifiers and optimized curing processes play vital roles in developing high-performance epoxy-based composites. Recent advances in molecular simulation and chemical calculation have revolutionized the way that we perceive the synthesis and performance of epoxy resins.

This Special Issue, titled “Epoxy Resin Synthesis, Performance and Application Research: Second Edition”, welcomes original research and reviews on the following: (1) novel technologies and approaches for the synthesis and characterization of epoxy resin systems; (2) advanced hardeners, modifiers, and accelerators for high-performance epoxy-based composites; (3) curing kinetics and mechanism analysis of various epoxy/curing agent systems combined with molecular simulation and chemical calculation methods; (4) the optimization of resin curing, infusion, and impregnation processes; and (5) epoxy-based composites and their applications.

Dr. Jin Li
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Molecules is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • synthesis, modification, and characterization
  • curing kinetics and mechanism
  • epoxy-based nanocomposites
  • interface characteristics
  • advanced hardeners, modifiers, and accelerators
  • thermal, mechanical, and dielectric properties
  • applications
  • quantum chemical calculations
  • molecular design

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Published Papers (1 paper)

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Research

14 pages, 3047 KiB  
Article
Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO2-Doped Epoxy Resins: A Molecular Simulation Study
by Kunqi Cui, Yang Wang, Wenchao Yan, Teng Cao, Yan Du, Kai Wu and Li Guo
Molecules 2025, 30(14), 2960; https://doi.org/10.3390/molecules30142960 - 14 Jul 2025
Viewed by 185
Abstract
As a key insulating material in power equipment, epoxy resins (EP) are often limited in practical applications due to space charge accumulation and mechanical degradation. This study systematically investigates the effects of SiO2 nanoparticle doping on the electrical and mechanical properties of [...] Read more.
As a key insulating material in power equipment, epoxy resins (EP) are often limited in practical applications due to space charge accumulation and mechanical degradation. This study systematically investigates the effects of SiO2 nanoparticle doping on the electrical and mechanical properties of SiO2/EP composites through molecular dynamics simulations and first-principles calculations. The results demonstrate that SiO2 doping enhances the mechanical properties of EP, with notable improvements in Young’s modulus, bulk modulus, and shear modulus, while maintaining excellent thermal stability across different temperatures. Further investigations reveal that SiO2 doping effectively modulates the interfacial charge behavior between EP and metals (Cu/Fe) by introducing shallow defect states and reconstructing interfacial dipoles. Density of states analysis indicates the formation of localized defect states at the interface in doped systems, which dominate the defect-assisted hopping mechanism for charge transport and suppress space charge accumulation. Potential distribution calculations show that doping reduces the average potential of EP (1 eV for Cu layer and 1.09 eV for Fe layer) while simultaneously influencing the potential distribution near the polymer–metal interface, thereby optimizing the interfacial charge injection barrier. Specifically, the hole barrier at the maximum valence band (VBM) after doping significantly increased, rising from the initial values of 0.448 eV (Cu interface) and 0.349 eV (Fe interface) to 104.02% and 209.46%, respectively. These findings provide a theoretical foundation for designing high-performance epoxy-based composites with both enhanced mechanical properties and controllable interfacial charge behavior. Full article
(This article belongs to the Special Issue Epoxy Resin Synthesis, Performance and Application Research: Second Edition)
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